Optoelectronic computing systems
    1.
    发明授权

    公开(公告)号:US11734556B2

    公开(公告)日:2023-08-22

    申请号:US17204320

    申请日:2021-03-17

    IPC分类号: G06N3/067 G06E1/04

    CPC分类号: G06N3/0675 G06E1/045

    摘要: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values. The first semiconductor die and the second semiconductor die are electrically coupled in a controlled collapse chip connection, with the electrical output port of the PIC connected to one of the electrical input ports of the EIC.

    Optoelectronic computing systems
    3.
    发明授权

    公开(公告)号:US11507818B2

    公开(公告)日:2022-11-22

    申请号:US16703278

    申请日:2019-12-04

    摘要: A system includes a first unit configured to generate a plurality of modulator control signals, and a processor unit. The processor unit includes: a light source or port configured to provide a plurality of light outputs, and a first set of optical modulators coupled to the light source or port and the first unit. The optical modulators in the first set are configured to generate an optical input vector by modulating the plurality of light outputs provided by the light source or port based on digital input values corresponding to a first set of modulator control signals in the plurality of modulator control signals, the optical input vector comprising a plurality of optical signals. The processor unit also includes a matrix multiplication unit that includes a second set of optical modulators. The matrix multiplication unit is coupled to the first unit, and is configured to transform the optical input vector into an analog output vector based on a plurality of digital weight values corresponding to a second set of modulator control signals in the plurality of modulator control signals applied to the second set of optical modulators. At least one optical modulator of at least one of the first set of optical modulators or the second set of optical modulators is configured to modulate an optical signal based on a first modulator control signal among the plurality of modulator control signals, and the first unit is configured to shape the first modulator control signal to include bandwidth-enhancement associated with a change in amplitude associated with a corresponding change in successive digital values corresponding to the first modulator control signal.

    OPTOELECTRONIC COMPUTING SYSTEMS
    4.
    发明申请

    公开(公告)号:US20210201126A1

    公开(公告)日:2021-07-01

    申请号:US17204320

    申请日:2021-03-17

    IPC分类号: G06N3/067 G06E1/04

    摘要: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values. The first semiconductor die and the second semiconductor die are electrically coupled in a controlled collapse chip connection, with the electrical output port of the PIC connected to one of the electrical input ports of the EIC.