公开(公告)号：US10283304B2

公开(公告)日：2019-05-07

申请号：US15410440

申请日：2017-01-19

Applicant: Littelfuse, Inc.

Inventor： James Beckert ,  Gregory Stumpo

IPC: H01H69/02 ,  H01H85/04 ,  H05K1/18 ,  H01H85/20

Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

公开(公告)号：US10790108B2

公开(公告)日：2020-09-29

申请号：US16364838

申请日：2019-03-26

Applicant: Littelfuse, Inc.

Inventor： James Beckert ,  Gregory Stumpo

IPC: H01H85/20 ,  H01H85/04 ,  H05K1/18 ,  H01H69/02

Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

公开(公告)号：US20190221396A1

公开(公告)日：2019-07-18

申请号：US16364838

申请日：2019-03-26

Applicant: Littelfuse, Inc.

Inventor： James Beckert ,  Gregory Stumpo

IPC: H01H85/04 ,  H01H69/02 ,  H05K1/18 ,  H01H85/20

Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.