公开(公告)号：US20240021505A1

公开(公告)日：2024-01-18

申请号：US17862692

申请日：2022-07-12

申请人： Littelfuse, Inc.

发明人： TIBURCIO A. MALDO ,  Rodri Hughes ,  Robert Ebido ,  Jeff Grozen ,  Josef Colquin A. Chua ,  Domingo Atienza, JR.

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/49838 ,  H01L21/4853

摘要： A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.