公开(公告)号：US20240021568A1

公开(公告)日：2024-01-18

申请号：US17864881

申请日：2022-07-14

申请人： Littelfuse, Inc.

发明人： Tiburcio A. Maldo ,  Rhodri Hughes ,  Robert Ebido ,  Jeff Grozen ,  Josef Colquin A. Chua ,  Domingo Atienza, JR.

IPC分类号： H01L23/00 ,  H01L23/14 ,  H01L23/15

CPC分类号： H01L24/37 ,  H01L24/40 ,  H01L23/142 ,  H01L23/15 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/73263 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/3702 ,  H01L2224/37026 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2924/3511

摘要： A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.

公开(公告)号：US20240021505A1

公开(公告)日：2024-01-18

申请号：US17862692

申请日：2022-07-12

申请人： Littelfuse, Inc.

发明人： TIBURCIO A. MALDO ,  Rodri Hughes ,  Robert Ebido ,  Jeff Grozen ,  Josef Colquin A. Chua ,  Domingo Atienza, JR.

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/49838 ,  H01L21/4853

摘要： A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.