公开(公告)号：US11053029B1

公开(公告)日：2021-07-06

申请号：US15945639

申请日：2018-04-04

Applicant: Lockheed Martin Corporation

Inventor： Neil Evan Goodzeit ,  Herbert H. Vichnin ,  Matthew T. Gallen

IPC: B64G1/58 ,  B64G1/64

Abstract: A modular spacecraft is provided. The modular spacecraft includes a bus module and a payload module. The bus module provides additional thermal radiative capacity for the payload module by including a bus-panel payload thermal zone that couples operational components of the payload module to a radiator panel in the bus module. The bus module also includes its own operational components that are thermally coupled to the radiator panel but that are thermally isolated from the payload module and the bus-panel payload thermal zone.