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    Tile saw with a tile hold down device
    8.
    发明授权
    Tile saw with a tile hold down device 有权
    瓷砖用瓦片压紧装置

    公开(公告)号：US08365714B2

    公开(公告)日：2013-02-05

    申请号：US13113614

    申请日：2011-05-23

    申请人： Robert H. Gifford ,  Marco Alessandro Mattucci ,  Jason Carl McRoberts ,  Brent Austin Kuehne ,  Micah Alan Coleman ,  Michael Frederick Cannaliato ,  Weston John Van Wambeke ,  Jeff Whitehead

    发明人： Robert H. Gifford ,  Marco Alessandro Mattucci ,  Jason Carl McRoberts ,  Brent Austin Kuehne ,  Micah Alan Coleman ,  Michael Frederick Cannaliato ,  Weston John Van Wambeke ,  Jeff Whitehead

    IPC分类号： B28D1/04

    CPC分类号： B28D1/043 ,  B23D59/003 ,  B27B27/08 ,  B28D7/04

    摘要： A tile cutting machine includes a tub for receiving water and a tile supporting surface for supporting thereon a tile to be cut. A cutting head assembly is positioned above the tile supporting surface and includes a motor driven blade. A tile hold down mechanism extends downwardly from the cutting head assembly to engage the tile and apply downward pressure thereto to hold the tile in place during the cutting process. The tile hold down mechanism may take the form of flexible hold down feet, downwardly biased rollers and/or bristle skirts. The tile supporting surface may be fabricated of a high friction material and include a plurality of nubs to cooperate with the hold down mechanism to hold the tile stationary with respect to the supporting surface during the cutting process. The tile cutting machine provides for a method of cutting tile where a user does not have to hold the tile with their hands during the cutting operation.

    摘要翻译： 瓦片切割机包括用于接收水的桶和用于在其上支撑待切割的瓦的瓦片支撑表面。 切割头组件位于瓦片支撑表面上方并且包括马达驱动的叶片。 瓦片压紧机构从切割头组件向下延伸以接合瓦片并向下施加压力以在切割过程中将瓦片保持在适当位置。 瓦片按压机构可以采取柔性压脚，向下偏压的滚轮和/或刷毛裙的形式。 瓦片支撑表面可以由高摩擦材料制成，并且包括多个凸块以与压紧机构配合，以在切割过程期间相对于支撑表面固定瓦片。 瓷砖切割机提供切割砖的方法，其中用户在切割操作期间不必用手握住瓷砖。