Method for material processing and/or material analysis using lasers
    1.
    发明授权
    Method for material processing and/or material analysis using lasers 有权
    使用激光的材料加工和/或材料分析方法

    公开(公告)号:US08097830B2

    公开(公告)日:2012-01-17

    申请号:US10508662

    申请日:2003-02-28

    IPC分类号: B23K26/00

    CPC分类号: B23K26/04 B23K26/0624

    摘要: The invention relates to a method for material processing and/or material analysis of an object (18) made from condensed matter by means of a laser (12). A laser pulse (14) is generated by a laser, emitted in the direction of the object. The laser pulse is spatially and temporally focussed such as to give a peak power for the laser pulse at a point between the laser and the object which exceeds the critical power for a self-focussing effect of the laser pulse. The laser pulse thus forms a filament (88) of high power density. The filament (88) is directed at the object and generates an aggregation state change there (evaporation or plasma formation) for a part of the material of the object. The method can be applied to both material processing (cutting, drilling, welding, hardening) and material analysis (analysis of the plasma light).

    摘要翻译: 本发明涉及一种用于通过激光(12)由冷凝物质制成的物体(18)的材料处理和/或材料分析方法。 通过激光产生激光脉冲(14),该激光在物体的方向上发射。 激光脉冲在空间和时间上被聚焦,以便在激光和物体之间的点处给出激光脉冲的峰值功率,该激光脉冲超过激光脉冲的自聚焦效应的临界功率。 因此,激光脉冲形成高功率密度的灯丝(88)。 灯丝(88)被引导到物体,并且对于物体的一部分材料产生聚集状态改变(蒸发或等离子体形成)。 该方法可应用于材料加工(切割,钻孔,焊接,硬化)和材料分析(等离子体光的分析)。