Dual thermal control element configuration for opto-mechanical assembly

    公开(公告)号:US11726280B2

    公开(公告)日:2023-08-15

    申请号:US17357274

    申请日:2021-06-24

    CPC classification number: G02B6/4266 G02B6/4206 G02B6/4214 G02B7/028

    Abstract: An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.

    Optimization of heater shape for integrated heater for optical benches

    公开(公告)号:US10684441B2

    公开(公告)日:2020-06-16

    申请号:US15717513

    申请日:2017-09-27

    Abstract: A method may include identifying, by a device, a set of components of an optical device. The method may include determining, by the device, a set of design criteria based on the set of components of the optical device. The method may include identifying, by the device, an initial heater configuration based on the set of design criteria. The method may include determining, by the device, a set of optimization parameters for determining a target heater configuration based on the set of design criteria. The method may include performing, by the device and based on the set of optimization parameters, an optimization procedure to alter the initial heater configuration to determine the target heater configuration. The method may include providing, by the device, information identifying the target heater configuration based on performing the optimization procedure.

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