BESSEL BEAM WITH AXICON FOR CUTTING TRANSPARENT MATERIAL

    公开(公告)号:US20210060707A1

    公开(公告)日:2021-03-04

    申请号:US16915373

    申请日:2020-06-29

    IPC分类号: B23K26/38 B23K26/53

    摘要: A Bessel beam laser-cutting system may comprise an ultrafast laser light source, an axicon, a first lens, and a second lens. The ultrafast light source may be configured to emit a beam into the axicon. The axicon may be configured to diffract the beam into a first/primary Bessel beam in a near field of the axicon and an annular beam in a far field of the axicon. The first lens may be configured to focus the annular beam. The second lens may be configured to converge the focused annular beam into a second/secondary Bessel beam to modify a transparent material, wherein a modification depth of the modification generated by the second/secondary Bessel beam is to be within a range of tens of micrometers to several millimeters inside the transparent material.