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    Cooling system for electronic assembly
    1.
    发明授权
    Cooling system for electronic assembly 失效
    电子组装冷却系统

    公开(公告)号：US4466255A

    公开(公告)日：1984-08-21

    申请号：US414448

    申请日：1982-09-02

    申请人： M. Dean Roush

    发明人： M. Dean Roush

    IPC分类号： H05K7/20 ,  F25D23/12

    CPC分类号： H05K7/20763

    摘要： An improved cooling system for electronic assemblies provides cold bars (10) and cold plates (60) for supporting and conducting heat away from a plurality of electronic assemblies (12, 52) attached thereto. A plurality of refrigerant holes (A-F, 70-77) are drilled through the cold bar or plate. End caps (27, 28, 61, 62) have well-like areas forming refrigerant return passages that cooperate with the cold bar or plate to interconnect individual refrigerant holes or groups of holes to form multiple pass refrigerant paths through the cold bar or plate to external connections for connecting to a refrigeration system. The holes are preferably threaded to improve heat transfer characteristics. The pattern, sizing, and grouping of holes can be varied to adjust the design of a particular cold bar or plate to the heat load of a given application.

    摘要翻译： 用于电子组件的改进的冷却系统提供用于从附接到其上的多个电子组件（12,52）支撑和传导热量的冷棒（10）和冷板（60）。 多个制冷剂孔（A-F，70-77）穿过冷棒或板钻。 端盖（27,28,61,62）具有形成制冷剂返回通道的良好区域，其与冷棒或板配合以互连各个制冷剂孔或孔组，以形成穿过冷棒或板的多通道制冷剂路径， 连接到制冷系统的外部连接。 孔优选地是螺纹的以改善传热特性。 可以改变孔的图案，尺寸和分组，以将特定冷棒或板的设计调整到给定应用的热负荷。