PACKAGING STRUCTURE
    1.
    发明公开
    PACKAGING STRUCTURE 审中-公开

    公开(公告)号:US20240359870A1

    公开(公告)日:2024-10-31

    申请号:US18574288

    申请日:2023-04-25

    CPC classification number: B65D25/108 B65D85/68 B65D2585/6877

    Abstract: A packaging structure of the disclosure includes: a box in which a component is stored; and a holding member installed in the box, the holding member being configured to hold the component. The holding member includes: an undersurface portion that has a first opening portion into which the component is inserted and is placed on a bottom surface of the box; a top surface portion that has a second opening portion into which the component is inserted and is placed above the undersurface portion; and a first side surface portion connecting the undersurface portion and the top surface portion in an up-and-down direction. The holding member is formed by being bent along boundary lines between the first side surface portion, the undersurface portion, and the top surface portion, and is formed into two kinds of three-dimensional shapes that are mirror symmetric to each other, according to bending directions of the boundary line.

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