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公开(公告)号：US20160320047A1
公开(公告)日：2016-11-03
申请号：US15108781
申请日：2014-10-30
发明人： Nanqing ZHOU , Rongkui WU
CPC分类号： F21V29/83 , F21K9/232 , F21K9/235 , F21K9/238 , F21S2/00 , F21V3/02 , F21V19/00 , F21V23/006 , F21V29/00 , F21V29/506 , F21V29/74 , F21Y2107/40 , F21Y2115/10
摘要： A bulb lamp structure includes a base, a seat, a circuit board, and a bulb housing, and further includes a plurality of chips on which LEDs are mounted, a heat dissipater, and a double-sided board. The seat has a lower rim in which an air inlet opening is formed. The heat dissipater has a lower portion forming an annular hood that has an upper end on which a plurality of plate-like substrates is arranged to circumferentially delimit a chamber in communication with the air inlet opening of the seat. The chips are respectively mounted on outside surfaces of the substrates. The bulb housing has a top end having a central portion in which a ventilation hole is formed to correspond to an air outlet opening formed in a top of the heat dissipater. A large illumination angle can be effectively realized and automatic production can be facilitated.
摘要翻译： 灯泡结构包括基座，座椅，电路板和灯泡壳体，并且还包括安装有LED的多个芯片，散热器和双面板。 座椅具有形成空气入口的下边缘。 散热器具有形成环形罩的下部，其具有上端，多个板状基板布置成沿圆周方向限定与座椅的进气口连通的室。 芯片分别安装在基板的外表面上。 灯泡壳体的顶端具有中心部分，在该中心部分形成通气孔，以对应于形成在散热器顶部的出气口。 可以有效地实现大的照明角度并且可以促进自动生产。
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公开(公告)号：US20190338894A1
公开(公告)日：2019-11-07
申请号：US16324894
申请日：2016-09-27
发明人： Nanqing ZHOU , Rongkui WU
摘要： A bulb holder structure includes a bulb holder, and a housing and a thermally conductive member fitting to the bulb holder. A protruding ring formed on an inner surface of the housing fits an annular base on a lower portion of the thermally conductive member. A plurality of protruding portions are peripherally distributed on an inner surface of the ring. An inner diameter defined by the protruding portions is smaller than an outer diameter of the base, that is, the ring forms an interference fit with the base of the thermally conductive member through the protruding portions, thereby effectively improving fit stability between the thermally conductive member and the housing, boosting yield, and ensuring excellent heat dissipation.
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