公开(公告)号：US20040226985A1

公开(公告)日：2004-11-18

申请号：US10842418

申请日：2004-05-11

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Tomoko Fukunaka ,  Masashi Ishiguro ,  Mamoru Watanabe ,  Kazuhiko Yamashita ,  Masahiro Sato ,  Ryoji Inutsuka ,  Kenji Takahashi ,  Toshikazu Yoneda

IPC: B23K031/02

CPC classification number: B23K1/0056 ,  B23K31/125

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract translation: 本发明提供一种光学处理装置，其能够准确地检测在与沉积物相同颜色的背景下粘附到光学装置的沉积物的粘附状态，防止由于焊丝的供给故障而发生焊接不良，并且当前端 焊丝的一部分不能到达处理区域。 该光学处理装置包括用于产生光能的光能输出装置，用于将光能引导到工件中的第一光路，设置在用于成形光能的第一光路中的光学装置，第二光路共享第一 用于将光从工件引导到光接收装置的光路，以及用于改变至少光学装置和工件的相对位置的驱动装置。

公开(公告)号：US20040226979A1

公开(公告)日：2004-11-18

申请号：US10833072

申请日：2004-04-28

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Masahiro Sato ,  Masashi Ishiguro ,  Tomoko Fukunaka ,  Kazuhiko Yamashita ,  Mamoru Watanabe ,  Ryoji Inutsuka ,  Kenji Takahashi ,  Toshikazu Yoneda

IPC: B23K001/00

CPC classification number: B23K1/0056 ,  B23K26/04 ,  B23K2101/42

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.

Abstract translation: 光学处理设备包括用于发射光的发射器，用于将光引导到在工件上被处理的位置的第一光路和处理头。 处理头包括设置在第一光路中的光学系统，用于使光成形，具有与第一光路共享的部分的第二光路，引导从工件反射的光的第二光路和用于接收的光接收器 来自第二光路的反射光。 光学处理装置还包括用于改变光学系​​统和工件之间的位置关系的致动器，用于向工件供应焊料的馈送器，用于沿第一方向平行于第一方向移动处理头的第一移位器， 从发射器发射的光;第二移位器，用于当处理头通过第一移位器移动离开工件时，将馈送器沿第一方向定位成远离处理头;以及第三移位器，用于将馈送器移动到处理头 在垂直于第一方向的第二方向上，当处理头被第一移位器移动时。 光学处理装置允许入射光的点和焊接位置根据工件的构造容易地设定，并且因此可以在针对工件优化的焊接条件下以更高的质量焊接工件。