公开(公告)号：US20040079791A1

公开(公告)日：2004-04-29

申请号：US10616194

申请日：2003-07-09

Applicant: MEC COMPANY LTD.

Inventor： Tetsuo Kida ,  Samuel Kenneth Liem

IPC: B23K001/20 ,  B23K031/02

CPC classification number: H05K3/26 ,  C23G1/00 ,  H05K3/3489 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/4913

Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.

Abstract translation: 印刷电路板的制造方法包括：用pH5以下的酸性电解水清洗与印刷电路板的铜电路的露出部分相对应的焊盘，以除去氧化物; 用pH不小于9的碱性电解水处理土地以防止氧化; 并将电子元件焊接到土地上。 预先用电解水处理要焊接的部分，从而以低成本改善焊接，而不会对环境产生不利影响。