公开(公告)号：US20190019763A1

公开(公告)日：2019-01-17

申请号：US16007032

申请日：2018-06-13

Applicant: MEDIATEK INC.

Inventor： Hung-Jen CHANG ,  Jen-Chuan CHEN ,  Hsueh-Te WANG ,  Wen-Sung HSU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/367 ,  H01L21/56 ,  H01L21/3205 ,  H01L23/00

Abstract: A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.