公开(公告)号：US20240038690A1

公开(公告)日：2024-02-01

申请号：US18211551

申请日：2023-06-19

Applicant: MEDIATEK INC.

Inventor： Po-Jui Li ,  Ruey-Bo Sun ,  Yen-Ju Lu ,  Chun-Yuan Yeh ,  Sheng-Mou Lin

IPC: H01L23/64 ,  H01L23/522

CPC classification number: H01L23/645 ,  H01L23/5227 ,  H01L23/5221 ,  H01L28/10

Abstract: A semiconductor device includes an electronic device, a guard trace and a first trace. The guard trace is connecting to a ground layer through a first ground via. The first trace is disposed adjacent to the electronic device and the guard trace and includes a first segment. A phase or a direction of a first current signal conducted on the first trace is changed in the first segment. The electronic device and the first trace are disposed at different sides of the guard trace and the first ground via is beside the first segment.