公开(公告)号：US12233477B2

公开(公告)日：2025-02-25

申请号：US18404992

申请日：2024-01-05

Applicant: MEDTRONIC, INC.

Inventor： David A. Ruben ,  Andreas Fenner ,  Andrew J. Ries ,  Robert A Munoz ,  Christopher T. Kinsey ,  Mark E. Henschel

IPC: B23K26/20 ,  A61N1/375 ,  A61N1/39 ,  B23K26/32

Abstract: Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

公开(公告)号：US09220902B2

公开(公告)日：2015-12-29

申请号：US14179795

申请日：2014-02-13

Applicant: Medtronic, Inc.

Inventor： Andrew J Ries ,  Terrence J Snyder ,  Iryna M Levina ,  Robert A Munoz ,  Eric J Wengreen ,  John E Lovins

IPC: A61N1/00 ,  A61N1/362 ,  B23K26/24 ,  H01M10/42 ,  H01M2/10 ,  A61N1/375 ,  A61N1/378

CPC classification number: A61N1/362 ,  A61N1/3754 ,  A61N1/3758 ,  A61N1/378 ,  B23K26/24 ,  H01M2/0207 ,  H01M2/1016 ,  H01M2/1022 ,  H01M10/425 ,  Y10T29/49826

Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.

Abstract translation: 可植入医疗装置包括两个连接在一起的导电外壳，其中第一外壳包含电子元件，第二外壳包含电源。 第二外壳，其全部或一部分位于第一外壳的外部，包括内层，外层和集管板，所有这些外壳均被配置为为电源提供冗余密封。 优选地，内层和外层由彼此嵌套的单独的金属板形成，其中，所述内层和外层优选直接机械和电接触。 形成内层的第一片大致符合位于其中的电源的轮廓，形成外层的第二片符合第一片的轮廓。 包含设备的连接器触点的绝缘壳体例如通过安装支架直接固定到第一和第二导电外壳。