SOLID FOOD, COMPRESSION MOLDED BODY OF FOOD POWDER, SOLID MILK, AND COMPRESSION MOLDED BODY OF POWDERED MILK

    公开(公告)号:US20230040233A1

    公开(公告)日:2023-02-09

    申请号:US17790826

    申请日:2020-09-03

    Abstract: Provided are a solid food, a compression molded body of a food powder, a solid milk, and a compression molded body of a powdered milk which can be produced with improved production efficiency while securing resistance to breakage. A solid food is a solid food having a solid form obtained by compression molding a food powder, in which a packing fraction of the solid food is configured such that an average value A from a surface of the solid food to a depth of 2 mm is larger than an average value C from a depth of 4 mm from the surface of the solid food to a depth of 6 mm, and a rate of increase (A−C)/C×100 of the packing fraction obtained by dividing a difference (A−C) between the average value A and the average value C by the average value C is 6.5% or less.

    METHOD FOR PRODUCING SOLID FOOD PRODUCT, AND METHOD FOR PRODUCING SOLID MILK

    公开(公告)号:US20220330566A1

    公开(公告)日:2022-10-20

    申请号:US17641719

    申请日:2020-07-31

    Abstract: A method for producing a solid food having a solid form obtained by compression molding a food powder includes: compression molding the food powder to form a compression molded body of the food powder; and performing a hardening treatment on the compression molded body of the food powder, in which the hardening treatment includes placing the compression molded body of the food powder under an environment of a humidity of 100% RH or less and a temperature of higher than 100° C.

    SOLID FOOD AND SOLID MILK
    3.
    发明申请

    公开(公告)号:US20220322688A1

    公开(公告)日:2022-10-13

    申请号:US17642382

    申请日:2020-09-03

    Abstract: A solid food has a solid form obtained by compression molding a powder. Where a dissolution process from the solid food starting to dissolve until completely dissolving is measured over time on the basis of electric conductivity, times at which a dissolution ratio where electric conductivity at the time of finish of dissolution is 100%, reaches 20%, 63%, and 95% are t20, t63, and t95, and times (sec) at which the dissolution ratio of a reference solid food, formed under conditions in which a difference in weight with the solid food is within ±0.3%, a difference in surface area is within ±2%, a difference in hardness is within ±4%, and a humidification treatment temperature is 100° C. or lower, reaches 20%, 63%, and 95% are t20ref, t63ref, and t95ref, a solubility index (Id) represented by the following Formula (1) is less than 1. Id=(t20/t20ref+t63/t63ref+t95/t95ref)/3  (1)

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