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公开(公告)号:US20230040233A1
公开(公告)日:2023-02-09
申请号:US17790826
申请日:2020-09-03
Applicant: MEIJI CO., LTD.
Inventor: Keigo HANYU , Tetsu KAMIYA , Koji YAMAMURA , Jin OGIWARA
IPC: A23C9/18
Abstract: Provided are a solid food, a compression molded body of a food powder, a solid milk, and a compression molded body of a powdered milk which can be produced with improved production efficiency while securing resistance to breakage. A solid food is a solid food having a solid form obtained by compression molding a food powder, in which a packing fraction of the solid food is configured such that an average value A from a surface of the solid food to a depth of 2 mm is larger than an average value C from a depth of 4 mm from the surface of the solid food to a depth of 6 mm, and a rate of increase (A−C)/C×100 of the packing fraction obtained by dividing a difference (A−C) between the average value A and the average value C by the average value C is 6.5% or less.
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公开(公告)号:US20220330566A1
公开(公告)日:2022-10-20
申请号:US17641719
申请日:2020-07-31
Applicant: Meiji Co., Ltd.
Inventor: Aya KATO , Keigo HANYU , Tetsu KAMIYA , Jin OGIWARA
Abstract: A method for producing a solid food having a solid form obtained by compression molding a food powder includes: compression molding the food powder to form a compression molded body of the food powder; and performing a hardening treatment on the compression molded body of the food powder, in which the hardening treatment includes placing the compression molded body of the food powder under an environment of a humidity of 100% RH or less and a temperature of higher than 100° C.
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公开(公告)号:US20220322688A1
公开(公告)日:2022-10-13
申请号:US17642382
申请日:2020-09-03
Applicant: Meiji Co., Ltd.
Inventor: Aya KATO , Keigo HANYU , Tetsu KAMIYA , Jin OGIWARA
Abstract: A solid food has a solid form obtained by compression molding a powder. Where a dissolution process from the solid food starting to dissolve until completely dissolving is measured over time on the basis of electric conductivity, times at which a dissolution ratio where electric conductivity at the time of finish of dissolution is 100%, reaches 20%, 63%, and 95% are t20, t63, and t95, and times (sec) at which the dissolution ratio of a reference solid food, formed under conditions in which a difference in weight with the solid food is within ±0.3%, a difference in surface area is within ±2%, a difference in hardness is within ±4%, and a humidification treatment temperature is 100° C. or lower, reaches 20%, 63%, and 95% are t20ref, t63ref, and t95ref, a solubility index (Id) represented by the following Formula (1) is less than 1. Id=(t20/t20ref+t63/t63ref+t95/t95ref)/3 (1)
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公开(公告)号:US20220408745A1
公开(公告)日:2022-12-29
申请号:US17642091
申请日:2020-09-03
Applicant: Meiji Co., Ltd.
Inventor: Keigo HANYU , Aya KATO , Tetsu KAMIYA , Jin OGIWARA
Abstract: A solid food is a solid food having a solid form obtained by compression-molding a powder, the solid food including a body having a first face and a second face facing each other back to back. The body is provided with at least one hole penetrating the body from the first face to reach to the second face, and each of the first face, the second face, and an inner surface of the hole is an outer surface harder than an inner part of the body.
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公开(公告)号:US20220346431A1
公开(公告)日:2022-11-03
申请号:US17763566
申请日:2020-09-03
Applicant: Meiji Co., Ltd.
Inventor: Keigo HANYU , Tetsu KAMIYA , Koji YAMAMURA , Jin OGIWARA
Abstract: A solid food is a solid food having a solid form obtained by compression molding and hardening a food powder, in which a specific surface area voxel ratio of the solid food is configured such that an average value A from a surface of the solid food to a depth of 2 mm is smaller than an average value C from a depth of 4 mm from the surface of the solid food to a depth of 6 mm, and a rate of decrease (C−A)/C×100 of the specific surface area voxel ratio obtained by dividing a difference (C−A) between the average value C and the average value A by the average value C is 9.5% or less.
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