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公开(公告)号:US09325418B2
公开(公告)日:2016-04-26
申请号:US14354759
申请日:2012-10-25
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor: Toshitaka Kuroda , Satoru Yoshida , Toshiyasu Ito
CPC classification number: H04B10/40 , G02B6/4201 , G02B6/4246 , G02B6/4281 , G02B6/4284 , H05K1/189 , H05K2201/10121
Abstract: On a predetermined mounting surface of a surface (22A) of a flexible wiring board (22), a flexible wiring board pressing plate (28) which presses the mounting surface against a lower cover (12) is provided at a position immediately below a first radiation block (24) and a pressing sheet (26). The flexible wiring board pressing plate (28) has five pairs of projections (28PA and 28PB) respectively arranged in lines. The projections (28PA and 28PB) are formed to intersect conductive patterns (22ACP) at predetermined intervals.
Abstract translation: 在柔性布线板(22)的表面(22A)的预定的安装表面上,将紧固在下盖(12)上的安装表面的柔性布线板压板(28)设置在第一 辐射块(24)和按压片(26)。 柔性线路板按压板(28)具有分别配置成5对的突起(28PA,28PB)。 突起(28PA和28PB)形成为以预定间隔相交于导电图案(22ACP)。
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公开(公告)号:US20140284463A1
公开(公告)日:2014-09-25
申请号:US14354759
申请日:2012-10-25
Inventor: Toshitaka Kuroda , Satoru Yoshida , Toshiyasu Ito
IPC: H04B10/40
CPC classification number: H04B10/40 , G02B6/4201 , G02B6/4246 , G02B6/4281 , G02B6/4284 , H05K1/189 , H05K2201/10121
Abstract: On a predetermined mounting surface of a surface (22A) of a flexible wiring board (22), a flexible wiring board pressing plate (28) which presses the mounting surface against a lower cover (12) is provided at a position immediately below a first radiation block (24) and a pressing sheet (26). The flexible wiring board pressing plate (28) has five pairs of projections (28PA and 28PB) respectively arranged in lines. The projections (28PA and 28PB) are formed to intersect conductive patterns (22ACP) at predetermined intervals.
Abstract translation: 在柔性布线板(22)的表面(22A)的预定的安装表面上,将紧固在下盖(12)上的安装表面的柔性布线板压板(28)设置在第一 辐射块(24)和按压片(26)。 柔性线路板按压板(28)具有分别配置成5对的突起(28PA,28PB)。 突起(28PA和28PB)形成为以预定间隔相交于导电图案(22ACP)。
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