公开(公告)号：US20100220455A1

公开(公告)日：2010-09-02

申请号：US12775766

申请日：2010-05-07

申请人： MING-TAN HSU ,  I-CHENG SHIH

发明人： MING-TAN HSU ,  I-CHENG SHIH

IPC分类号： H05K1/14

CPC分类号： G01R31/026 ,  G01R31/046 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663

摘要： The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.

摘要翻译： 本发明提供用于即时电路检查的电路基板的接合结构。 接合结构的接触焊盘设计具有连接两个电路基板时的电路连接的即时检测能力。 在两个接合电路基板中，输入到电路部分的信号将导电粒子传递到第一接触焊盘，然后从第一接触焊盘再次将导电粒子传递到检测部分。 因此，测量输出信号可以检测接合电路基板的电路连接的可靠性。 如果输出信号与输入信号相同，则验证第一接触焊盘与电路部分之间的接合结构，否则，接合结构无效。