公开(公告)号：US20220224001A1

公开(公告)日：2022-07-14

申请号：US17605218

申请日：2020-04-21

Applicant: MITSUI CHEMICALS, INC.

Inventor： Takahiro TOMINAGA ,  Kai MORIMOTO ,  Kazuki KIMURA ,  Wataru MAKIGUCHI ,  Kosuke UEDA

IPC: H01Q1/40 ,  H01Q1/38 ,  H01Q1/24

Abstract: Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.

公开(公告)号：US20250092220A1

公开(公告)日：2025-03-20

申请号：US18727913

申请日：2023-01-06

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kosuke UEDA ,  Wataru MAKIGUCHI ,  Haruka DOI ,  Kohei NISHINO ,  Isao WASHIO ,  Takahiro KONDO

IPC: C08K3/105 ,  C08K3/34 ,  C08K5/09 ,  C08K7/14

Abstract: This polyamide resin composition includes a polyamide resin and a copper-based heat-resistant stabilizing agent. The copper content in the copper-based stabilizing agent is 0.001-0.050 parts by mass with respect to 100 parts by mass of the polyamide resin. The polyamide resin includes a dicarboxylic acid-derived component unit (a) and a diamine-derived component unit (b). The dicarboxylic acid-derived component unit (a) includes an aromatic dicarboxylic acid-derived component unit or an alicyclic dicarboxylic acid-derived component unit. The diamine-derived component unit (b) includes a diamine-derived component unit (b2) represented by formula (1) in an amount of 10 mol % or more but less than 50 mol % with respect to the total number of moles of the diamine-derived component unit (b).