公开(公告)号：US20230145824A1

公开(公告)日：2023-05-11

申请号：US17795743

申请日：2021-01-29

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kazuki KIMURA ,  Tomoki TORII ,  Takahiro TOMINAGA ,  Kai MORIMOTO ,  Shinji NAKAJIMA ,  Isao WASHIO ,  Nobuyoshi SHIMBORI ,  Junya SHIMAZAKI ,  Jingjun ZHANG ,  Akinori AMANO ,  Haruka DOI

IPC: H01B3/30 ,  H01M50/522 ,  H01M50/524 ,  H01B3/44 ,  H01B1/02 ,  H01B13/00 ,  H01B13/06 ,  H02K3/50 ,  C08L77/06

CPC classification number: H01B3/306 ,  H01M50/522 ,  H01M50/524 ,  H01B3/441 ,  H01B1/02 ,  H01B13/0036 ,  H01B13/06 ,  H02K3/50 ,  C08L77/06 ,  H02K2203/09 ,  B29C45/14311

Abstract: A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m2) measured by a krypton adsorption method by a geometric surface area (m2), of 4.0 or more.

公开(公告)号：US20250169039A1

公开(公告)日：2025-05-22

申请号：US18728943

申请日：2022-12-15

Applicant: MITSUI CHEMICALS, INC.

Inventor： Takahiro TOMINAGA ,  Kai MORIMOTO

IPC: H05K7/20

Abstract: The temperature control device of the disclosure is a temperature control device for controlling the temperature of at least one heat exchange object. This temperature control device includes: a first plate made of a metal; a second plate; a flow path wall part sandwiched between the first plate and the second plate; and a resin fixing part fixing the second plate to the first plate. An internal flow path for circulating a heat exchange medium is formed by at least one of the first plate or the second plate, and the flow path wall part. The first plate includes at least one connection region for thermally connecting the at least one heat exchange object thereto, at an outer main surface of a side at which the flow path wall part is not arranged. The resin fixing part covers a region of the outer main surface, excluding the at least one connection region.

公开(公告)号：US20220224001A1

公开(公告)日：2022-07-14

申请号：US17605218

申请日：2020-04-21

Applicant: MITSUI CHEMICALS, INC.

Inventor： Takahiro TOMINAGA ,  Kai MORIMOTO ,  Kazuki KIMURA ,  Wataru MAKIGUCHI ,  Kosuke UEDA

IPC: H01Q1/40 ,  H01Q1/38 ,  H01Q1/24

Abstract: Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.