公开(公告)号：US20190189338A1

公开(公告)日：2019-06-20

申请号：US16326185

申请日：2017-08-30

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： Gyeong Tae KIM ,  Tae Geun SEO ,  Sang Jun PARK

IPC: H01F27/29 ,  H01F27/255 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04

CPC classification number: H01F27/29 ,  H01F17/00 ,  H01F27/02 ,  H01F27/022 ,  H01F27/255 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/2828 ,  H01F27/32 ,  H01F41/04

Abstract: Provided is a power inductor. The power inductor includes a body including metal powder and an insulation material, at least one base provided in the body, at least one coil pattern disposed on at least one surface of the base, and an external electrode disposed on each of at least two side surfaces of the body. At least a portion of the external electrode is made of the same material as the coil pattern.

公开(公告)号：US20190051446A1

公开(公告)日：2019-02-14

申请号：US16077439

申请日：2017-03-13

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Seung Hun CHO ,  Gyeong Tae KIM ,  Jun Ho JUNG ,  Sang Jun PARK

IPC: H01F27/28 ,  H01F41/04 ,  H01F27/32 ,  C25D5/02 ,  C25D3/38 ,  C25D5/10 ,  C25D7/00

Abstract: Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.

公开(公告)号：US20200335254A1

公开(公告)日：2020-10-22

申请号：US16077725

申请日：2017-03-13

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： In Kil PARK ,  Seung Hun CHO ,  Gyeong Tae KIM ,  Jun Ho JUNG ,  Sang Jun PARK

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01L23/64

Abstract: Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.