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公开(公告)号:US20220325154A1
公开(公告)日:2022-10-13
申请号:US17222329
申请日:2021-04-05
Applicant: Momentive Performance Materials Inc.
Inventor: Arindam Sannigrahi , Sandeep Naik , Meenal Mehra , Debarshi Dasgupta , Tiberiu Mircea Siclovan , Kwanho Chang
IPC: C09J183/04 , C08G77/00
Abstract: A process for producing a silicone pressure sensitive adhesive is shown and described herein. The process comprises reacting a MQ silicone resin with a polydiorganosiloxane in the absence of a solvent. The MQ silicone resin is a solid, solventless MQ resin. The reaction may be conducted in the presence of a catalyst, a chain extension reagent, or a combination thereof, and the resulting pressure sensitive adhesive can be dissolved in a solvent and the solids content adjusted. The present method provides a manner to provide a cleaner adhesive material that is free of unwanted materials such as aromatic solvents and also substantially free of cyclic siloxane impurities.
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公开(公告)号:US20240409796A1
公开(公告)日:2024-12-12
申请号:US18206265
申请日:2023-06-06
Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
Inventor: Kwanho Chang , Yeonseok Cho , Tiberiu Siclovan , David Newsham
IPC: C09J183/08 , H10K50/844 , H10K85/10
Abstract: A silicone adhesive is shown and described herein. The silicone adhesive composition comprises a silicone resin, a silicone fluid, and an aminosilane. The aminosilane contains two or more amino groups, where the amino groups can be bound to a single silicon atom or may be bound to separate silicon atoms in a silicon core unit. The silicone adhesive compositions are suitable for use as hot melt adhesives and can be used to coat or otherwise encapsulate an article.
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公开(公告)号:US12049576B2
公开(公告)日:2024-07-30
申请号:US17222329
申请日:2021-04-05
Applicant: Momentive Performance Materials Inc.
Inventor: Arindam Sannigrahi , Sandeep Naik , Meenal Mehra , Debarshi Dasgupta , Tiberiu Mircea Siclovan , Kwanho Chang
IPC: C09J183/04 , C08G77/00 , C08G77/44 , C09J183/10
CPC classification number: C09J183/04 , C08G77/44 , C08G77/70 , C09J183/10 , C08G2170/40
Abstract: A process for producing a silicone pressure sensitive adhesive is shown and described herein. The process comprises reacting a MQ silicone resin with a polydiorganosiloxane in the absence of a solvent. The MQ silicone resin is a solid, solventless MQ resin. The reaction may be conducted in the presence of a catalyst, a chain extension reagent, or a combination thereof, and the resulting pressure sensitive adhesive can be dissolved in a solvent and the solids content adjusted. The present method provides a manner to provide a cleaner adhesive material that is free of unwanted materials such as aromatic solvents and also substantially free of cyclic siloxane impurities.
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