公开(公告)号：US11825607B2

公开(公告)日：2023-11-21

申请号：US17258900

申请日：2020-05-15

Applicant: MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.

Inventor： Meng Mei ,  Gang Shi ,  Peichun Wang ,  Guangfeng Li

IPC: H05K3/00 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K3/0044 ,  H05K1/0306 ,  H05K1/0366 ,  H05K3/0011 ,  H05K3/06 ,  H05K2201/029

Abstract: A manufacturing method for a package substrate, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.