公开(公告)号：US11968780B2

公开(公告)日：2024-04-23

申请号：US17805229

申请日：2022-06-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kyle Indukummar Giesen ,  Sarah K. Czaplewski-Campbell ,  Roger S. Krabbenhoft

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0366 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/429 ,  H05K2201/029

Abstract: An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.

公开(公告)号：US11891730B2

公开(公告)日：2024-02-06

申请号：US17887374

申请日：2022-08-12

Applicant: Siren Care, Inc.

Inventor： Jie Fu ,  Ran Ma ,  Henk Jan Scholten

IPC: D02G3/44 ,  A61B5/01 ,  D04B1/24 ,  A61B5/00 ,  D04B1/26 ,  D03D1/00 ,  H05K1/18 ,  A41D1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/34

CPC classification number: D02G3/441 ,  A61B5/01 ,  A61B5/6807 ,  A61B5/742 ,  D02G3/44 ,  D03D1/0088 ,  D04B1/24 ,  D04B1/26 ,  H05K1/181 ,  A41D1/005 ,  A61B2560/0209 ,  A61B2560/0242 ,  A61B2562/029 ,  A61B2562/0219 ,  A61B2562/0247 ,  A61B2562/0257 ,  A61B2562/04 ,  A61B2562/125 ,  D10B2401/18 ,  D10B2403/02431 ,  D10B2501/043 ,  H05K1/0393 ,  H05K3/284 ,  H05K3/3415 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

公开(公告)号：US11825607B2

公开(公告)日：2023-11-21

申请号：US17258900

申请日：2020-05-15

Applicant: MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.

Inventor： Meng Mei ,  Gang Shi ,  Peichun Wang ,  Guangfeng Li

IPC: H05K3/00 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K3/0044 ,  H05K1/0306 ,  H05K1/0366 ,  H05K3/0011 ,  H05K3/06 ,  H05K2201/029

Abstract: A manufacturing method for a package substrate, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.

公开(公告)号：US20230371188A1

公开(公告)日：2023-11-16

申请号：US18027885

申请日：2021-09-21

Applicant: Denka Company Limited

Inventor： Shun UCHIYAMA ,  Yusuke MASUDA

IPC: H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4632 ,  H05K1/03 ,  H05K2201/0129 ,  H05K2201/029 ,  H05K2201/0209 ,  H05K2203/06

Abstract: Provided are an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear thermal expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate. An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.

公开(公告)号：US20230354516A1

公开(公告)日：2023-11-02

申请号：US18097780

申请日：2023-01-17

Applicant: Nextiles, Inc.

Inventor： George L. SUN

IPC: H05K1/03 ,  B32B5/06 ,  B32B3/26 ,  B32B5/02 ,  B32B27/12 ,  D03D1/00 ,  D04B1/14

CPC classification number: H05K1/038 ,  B32B5/073 ,  B32B3/266 ,  B32B5/02 ,  B32B27/12 ,  D03D1/0088 ,  D04B1/14 ,  H05K1/0366 ,  B32B2307/202 ,  B32B2457/08 ,  D10B2401/16 ,  D10B2401/18 ,  D10B2403/02431 ,  H05K2201/0281 ,  H05K2201/029

Abstract: An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.

公开(公告)号：US20180270949A1

公开(公告)日：2018-09-20

申请号：US15986553

申请日：2018-05-22

Applicant: FUJITSU LIMITED

Inventor： Taiga Fukumori

IPC: H05K1/03 ,  H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0366 ,  H01P3/08 ,  H01P3/082 ,  H01P3/085 ,  H05K1/02 ,  H05K1/0225 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A circuit board includes an insulation layer, a signal line formed over the insulation layer and extending in a direction X, and a conductor layer formed under the insulation layer. The insulation layer has periodic dielectric-constant distribution in a direction Y orthogonal to the direction X. The conductor layer includes a slit at a position corresponding to the signal line. The slit expands an electric field produced between the signal line and the conductor layer; causes less difference in dielectric constants of the insulation layer in the vicinity of the signal line (the difference is caused by the positional relationship between the signal line and the dielectric-constant distribution of the insulation layer); and reduces difference in signal transmission speeds caused by the positional relationship.

公开(公告)号：US20180187347A1

公开(公告)日：2018-07-05

申请号：US15702336

申请日：2017-09-12

Applicant: Intel Corporation

Inventor： David Graumann ,  David Bruneau

IPC: D03J1/00 ,  H05K1/03 ,  D03D1/00 ,  D03D15/00 ,  D03D15/02 ,  H05K1/18

CPC classification number: D03J1/00 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/02 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2401/16 ,  D10B2503/04 ,  D10B2505/08 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/5313

Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

公开(公告)号：US09944766B2

公开(公告)日：2018-04-17

申请号：US15502514

申请日：2015-08-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masaaki Matsumoto ,  Takatoshi Mito ,  Tatuo Yonemoto

IPC: C08J5/24 ,  C09D163/00 ,  H05K1/03 ,  B32B15/08

CPC classification number: C08J5/24 ,  B32B15/08 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2433/14 ,  C08K3/36 ,  C08L63/00 ,  C09D163/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/029

Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.

公开(公告)号：US20180098434A1

公开(公告)日：2018-04-05

申请号：US15719565

申请日：2017-09-29

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Masakazu SAKAMOTO

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/06 ,  H05K1/03

CPC classification number: H05K3/0038 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/064 ,  H05K3/403 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/029 ,  H05K2203/1383

Abstract: A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

公开(公告)号：US09902851B2

公开(公告)日：2018-02-27

申请号：US14435585

申请日：2013-10-18

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Hiroshi Takahashi ,  Tomo Chiba ,  Nobuyoshi Ohnishi ,  Katsuya Tomizawa ,  Keisuke Takada ,  Eisuke Shiga ,  Takaaki Ogashiwa

IPC: C08L63/00 ,  C08G59/62 ,  H05K1/03 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  B32B15/092 ,  B32B27/06 ,  B32B27/28 ,  B32B27/38 ,  B32B5/02 ,  B32B15/14 ,  C08L83/06 ,  C08G77/04 ,  C08G77/14

CPC classification number: C08L63/00 ,  B32B5/024 ,  B32B15/092 ,  B32B15/14 ,  B32B27/06 ,  B32B27/28 ,  B32B27/283 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/621 ,  C08G77/045 ,  C08G77/14 ,  C08J5/24 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2479/04 ,  C08J2483/06 ,  C08K3/013 ,  C08K3/34 ,  C08K3/36 ,  C08L71/126 ,  C08L83/06 ,  C08L2201/08 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2205/035 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08K3/0033

Abstract: A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.