公开(公告)号：US20210282287A1

公开(公告)日：2021-09-09

申请号：US17331066

申请日：2021-05-26

Applicant: MTD Products Inc

Inventor： Ryan Cmich ,  Joseph Saunders

IPC: H05K5/06 ,  H05K5/02 ,  H02G3/08 ,  H02G15/013

Abstract: A sealing system for an electronics enclosure includes an enclosure having a first enclosure half and a second enclosure half, the first enclosure half including at least one sidewall, a multi-lip radial sealing member having a plurality of lip elements, the lip elements extending perpendicularly to the side wall, the radial sealing member being positioned between the first enclosure half and the second enclosure half such that the radial sealing member remains flush against the enclosure, and the lip elements form continuous points of contact around the perimeter of the enclosure.

公开(公告)号：US11596076B2

公开(公告)日：2023-02-28

申请号：US17331066

申请日：2021-05-26

Applicant: MTD Products Inc

Inventor： Ryan Cmich ,  Joseph Saunders

IPC: H05K5/06 ,  H05K5/02 ,  H02G3/08 ,  H02G15/013 ,  H05K5/03

Abstract: A sealing system for an electronics enclosure includes an enclosure having a first enclosure half and a second enclosure half, the first enclosure half including at least one sidewall, a multi-lip radial sealing member having a plurality of lip elements, the lip elements extending perpendicularly to the side wall, the radial sealing member being positioned between the first enclosure half and the second enclosure half such that the radial sealing member remains flush against the enclosure, and the lip elements form continuous points of contact around the perimeter of the enclosure.