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公开(公告)号：US20240158941A1
公开(公告)日：2024-05-16
申请号：US18418429
申请日：2024-01-22
发明人： Roger Bernards , Emely Abel-Tatis
CPC分类号： C25D3/48 , H05K3/181 , H05K3/4661
摘要： An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.
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公开(公告)号：US20210371998A1
公开(公告)日：2021-12-02
申请号：US16884314
申请日：2020-05-27
发明人： Roger Bernards , Emely Abel-Tatis
摘要： An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.
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