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1.
公开(公告)号:US20250028020A1
公开(公告)日:2025-01-23
申请号:US18907695
申请日:2024-10-07
Applicant: Magna Mirrors of America, Inc.
Inventor: Traian Miu , Gabriele W. Sabatini , Kurt M. Schatz , Eric Peterson , Gregory A. Huizen , James J. Ferri
IPC: G01S7/02 , E05B85/10 , G01S13/931
Abstract: A vehicular exterior door handle assembly includes a base portion disposed at a door handle region of a vehicular door, a handle portion attached at the base portion, a radar unit, and a heat dissipating element. The interior portion of the handle portion includes a first zone and a second zone separated from the first zone by a thermally insulating barrier. The radar unit is disposed at and generates heat at the first zone of the interior portion of the handle portion. The heat dissipating element includes a heat pipe. A first end of the heat pipe is in thermal conductivity with the radar unit within the first zone, and a second end of the heat pipe distal from the first end is disposed in the second zone. The heat pipe is configured to dissipate heat from the first zone to the second zone.
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2.
公开(公告)号:US20220187416A1
公开(公告)日:2022-06-16
申请号:US17643609
申请日:2021-12-10
Applicant: Magna Mirrors of America, Inc.
Inventor: Traian Miu , Gabriele W. Sabatini , Kurt M. Schatz , Eric Peterson , Gregory A. Huizen , James J. Ferri
IPC: G01S7/02 , E05B85/10 , G01S13/931
Abstract: A radar sensor assembly includes a sensor printed circuit board (PCB) having a first side and a second side opposite the first side. A radar transceiver is disposed at the first side of the sensor PCB and includes a plurality of antennas configured for transmitting and receiving radio frequency (RF) radiation. A heat sink is disposed adjacent to the radar transceiver and is configured to dissipate heat from the radar transceiver. The radar transceiver is sandwiched between the heat sink and the sensor PCB. The heat sink is configured to allow the RF radiation to pass therethrough without guiding the RF radiation.
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3.
公开(公告)号:US12117555B2
公开(公告)日:2024-10-15
申请号:US17643609
申请日:2021-12-10
Applicant: Magna Mirrors of America, Inc.
Inventor: Traian Miu , Gabriele W. Sabatini , Kurt M. Schatz , Eric Peterson , Gregory A. Huizen , James J. Ferri
IPC: G01S7/02 , E05B85/10 , G01S13/931
CPC classification number: G01S7/027 , E05B85/10 , G01S13/931 , G01S2013/9315 , G01S2013/93274
Abstract: A radar sensor assembly includes a sensor printed circuit board (PCB) having a first side and a second side opposite the first side. A radar transceiver is disposed at the first side of the sensor PCB and includes a plurality of antennas configured for transmitting and receiving radio frequency (RF) radiation. A heat sink is disposed adjacent to the radar transceiver and is configured to dissipate heat from the radar transceiver. The radar transceiver is sandwiched between the heat sink and the sensor PCB. The heat sink is configured to allow the RF radiation to pass therethrough without guiding the RF radiation.
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