公开(公告)号：US20100242612A1

公开(公告)日：2010-09-30

申请号：US12744020

申请日：2008-11-21

申请人： Shuzo Sano ,  Makoto Fukada ,  Akifumi Sako

发明人： Shuzo Sano ,  Makoto Fukada ,  Akifumi Sako

IPC分类号： G01N29/00

CPC分类号： G01N29/2406 ,  A61B8/06 ,  B06B1/0292 ,  G01N29/326 ,  G01N2291/044 ,  G01N2291/106

摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.

摘要翻译： 一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜， 提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。 超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

公开(公告)号：US08551003B2

公开(公告)日：2013-10-08

申请号：US12602119

申请日：2008-05-14

申请人： Makoto Fukada ,  Shuzo Sano ,  Akifumi Sako

发明人： Makoto Fukada ,  Shuzo Sano ,  Akifumi Sako

IPC分类号： A61B8/00

CPC分类号： B06B1/0292

摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.

摘要翻译： 提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。 超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。 在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭 具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。 超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

公开(公告)号：US08408063B2

公开(公告)日：2013-04-02

申请号：US12744020

申请日：2008-11-21

申请人： Shuzo Sano ,  Makoto Fukada ,  Akifumi Sako

发明人： Shuzo Sano ,  Makoto Fukada ,  Akifumi Sako

IPC分类号： G01N29/00

CPC分类号： G01N29/2406 ,  A61B8/06 ,  B06B1/0292 ,  G01N29/326 ,  G01N2291/044 ,  G01N2291/106

摘要： An ultrasonic probe including a cMUT chip that has plural oscillation elements whose electromechanical coupling coefficient or sensitivity varies in accordance with a bias voltage and transmits/receives an ultrasonic wave, an acoustic lens provided at an ultrasonic wave transmission/reception side of the cMUT chip, a backing layer provided to the opposite surface of the cMUT chip to the acoustic lens, and a substrate provided between the backing layer and the cMUT chip. The ultrasonic probe further includes thermal stress suppressing means for suppressing thermal stress occurring due to the difference in linear expansion coefficient caused by temperature variation between the substrate and the backing layer.

摘要翻译： 一种超声波探头，包括具有机电耦合系数或灵敏度根据偏置电压而变化并发送/接收超声波的多个振荡元件的cMUT芯片，设置在cMUT芯片的超声波发送/接收侧的声透镜， 提供给cMUT芯片相对于声透镜的相对表面的背衬层，以及设置在背衬层和cMUT芯片之间的衬底。 超声波探头还包括用于抑制由于基板和背衬层之间的温度变化引起的线膨胀系数的差异而产生的热应力的热应力抑制装置。

公开(公告)号：US20110071396A1

公开(公告)日：2011-03-24

申请号：US12992683

申请日：2009-05-13

申请人： Shuzo Sano ,  Yasuhiro Yoshimura ,  Tatsuya Nagata ,  Makoto Fukada ,  Akifumi Sako

发明人： Shuzo Sano ,  Yasuhiro Yoshimura ,  Tatsuya Nagata ,  Makoto Fukada ,  Akifumi Sako

IPC分类号： A61B8/14 ,  G10K9/12 ,  H04R31/00

CPC分类号： B06B1/0292 ,  A61B8/06 ,  A61B8/13 ,  A61B8/4455 ,  G01N29/2406 ,  Y10T29/49005

摘要： An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.

摘要翻译： 超声波探头设置有具有多个换能器元件的CMUT芯片，该多个换能器元件根据用于发送和接收超声波的偏置电压来改变机电耦合系数或灵敏度，形成在CMUT芯片的超声照射侧上的导电层， 布置在CMUT芯片的超声波照射侧的声透镜，与声透镜的超声波照射侧相反的方向形成的绝缘层，存储CMUT芯片的壳体单元，其中导电层和绝缘层 用粘合剂和声透镜固定，其中绝缘层由至少包含氧化硅或对二甲苯的材料形成，以防止粘合剂的溶剂浸入粘附部分。

公开(公告)号：US20100154547A1

公开(公告)日：2010-06-24

申请号：US12602119

申请日：2008-05-14

申请人： Makoto Fukada ,  Shuzo Sano ,  Akifumi Sako

发明人： Makoto Fukada ,  Shuzo Sano ,  Akifumi Sako

IPC分类号： G01N29/24

CPC分类号： B06B1/0292

摘要： An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25. Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20, and a conductive member 63 is provided along the insulating member 62. A conductive film 61 and a conductive member 63 are connected by a conductive member 64. A closed space having a ground potential is formed by the conductive film 61, the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.

摘要翻译： 提供了能够提高操作者的电气安全性的超声波探头和超声波诊断装置。 超声波探头2在安装基板43和外壳25之间具有绝缘部62.由于可以防止来自超声波探头2的内部装置的漏电，因此能够提高操作者的超声波探头2的电气安全性。 在cMUT芯片20的超声波辐射侧设置有导电膜61，并且沿着绝缘构件62设置导电构件63.导电膜61和导电构件63通过导电构件64连接。封闭 具有接地电位的空间由导电膜61，导电构件63和连接到地的同轴电缆55形成。 超声波探头2的主要部件或体电路被包含在具有接地电位的封闭空间中并与外部电隔离。

公开(公告)号：US20130031980A1

公开(公告)日：2013-02-07

申请号：US13641695

申请日：2011-04-06

申请人： Akifumi Sako ,  Makoto Fukada ,  Kazunari Ishida

发明人： Akifumi Sako ,  Makoto Fukada ,  Kazunari Ishida

IPC分类号： G01N29/24 ,  B32B37/12

CPC分类号： B06B1/0292 ,  Y10T156/10

摘要： Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT (20) having vibratory elements that change the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied; a backing layer (22) adhered to the rear side of the ultrasonic transmission surface of the CMUT (20); and a thermal-stress balancing member (24) to be adhered to the backing layer (22) while being disposed facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween so as to minimize the warpage of the CMUT (20) due to thermal stress produced between the CMUT (20).

摘要翻译： 公开了一种超声波探头，其中由于在背衬层和CMUT之间的接合处产生的热应力引起的CMUT的翘曲最小化，从而提高了CMUT与背衬层之间的结合的耐久性。 为了实现这一点，超声波探头设置有：具有根据要施加的偏置电压改变机电耦合系数或灵敏度的振动元件的CMUT（20） 粘附到CMUT（20）的超声波传播表面的后侧的背衬层（22）; 以及在将背衬层（22）夹在其间的方式面对CMUT（20）设置的同时被粘附到背衬层（22）上的热应力平衡构件（24），以便最小化 CMUT（20）由于在CMUT（20）之间产生的热应力。

公开(公告)号：US20100198070A1

公开(公告)日：2010-08-05

申请号：US12668478

申请日：2008-07-01

申请人： Katsunori Asafusa ,  Makoto Fukada

发明人： Katsunori Asafusa ,  Makoto Fukada

IPC分类号： A61B8/14 ,  A61B8/00

CPC分类号： B06B1/0292 ,  A61B8/4444 ,  A61B8/4494

摘要： Provided are an ultrasonic probe and an ultrasonic diagnostic apparatus, which reduce parastic impedances which occurs in upper electrodes and lower electrodes, thereby reducing cross talk.The ultrasonic probe comprises a cMUT chip (20) having a plurality of transducer elements, an acoustic lens (26) on the ultrasonic wave irradiation side of the cMUT chip (20), a backing layer (22) on the back of the cMUT chip (20), and wires connected with the cMUT chip (20).This cMUT chip (20) includes a plurality of upper electrodes (46) and a plurality of lower electrodes (48), and these lower electrodes (48) are connected at two or more portions with wires.

摘要翻译： 提供了一种超声波探头和超声波诊断装置，其减少了发生在上部电极和下部电极中的残差阻抗，从而减少了串扰。 超声波探头包括具有多个换能器元件的cMUT芯片（20），cMUT芯片（20）的超声波照射侧上的声透镜（26），cMUT芯片背面的背衬层（22） （20），以及与cMUT芯片（20）连接的电线。 该cMUT芯片（20）包括多个上部电极（46）和多个下部电极（48），并且这些下部电极（48）以两个或多个部分与电线连接。

公开(公告)号：US09089873B2

公开(公告)日：2015-07-28

申请号：US12668478

申请日：2008-07-01

申请人： Katsunori Asafusa ,  Makoto Fukada

发明人： Katsunori Asafusa ,  Makoto Fukada

IPC分类号： A61B8/14 ,  A61B8/00 ,  B06B1/02

CPC分类号： B06B1/0292 ,  A61B8/4444 ,  A61B8/4494

摘要： Provided are an ultrasonic probe and an ultrasonic diagnostic apparatus, which reduce parastic impedances which occurs in upper electrodes and lower electrodes, thereby reducing cross talk.The ultrasonic probe comprises a cMUT chip (20) having a plurality of transducer elements, an acoustic lens (26) on the ultrasonic wave irradiation side of the cMUT chip (20), a backing layer (22) on the back of the cMUT chip (20), and wires connected with the cMUT chip (20).This cMUT chip (20) includes a plurality of upper electrodes (46) and a plurality of lower electrodes (48), and these lower electrodes (48) are connected at two or more portions with wires.

摘要翻译： 提供了一种超声波探头和超声波诊断装置，其减少了发生在上部电极和下部电极中的残差阻抗，从而减少了串扰。 超声波探头包括具有多个换能器元件的cMUT芯片（20），cMUT芯片（20）的超声波照射侧上的声透镜（26），cMUT芯片背面的背衬层（22） （20），以及与cMUT芯片（20）连接的电线。 该cMUT芯片（20）包括多个上部电极（46）和多个下部电极（48），并且这些下部电极（48）以两个或多个部分与电线连接。