公开(公告)号：US08093975B2

公开(公告)日：2012-01-10

申请号：US11896561

申请日：2007-09-04

申请人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

发明人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

IPC分类号： H01H9/02 ,  H02B1/00 ,  H05K5/00

CPC分类号： H05K7/1432

摘要： A semiconductor switching module including a housing having openings to remove pressure which occurs during a short circuit. The housing openings, which can be sealed by thin walls dimensioned so that so that parts which carry current cannot be touched from outside and the walls can be destroyed or removed by the pressure which occurs during a short circuit.

摘要翻译： 一种半导体开关模块，包括具有用于消除在短路期间发生的压力的开口的壳体。 可以通过薄壁密封的壳体开口的尺寸设计成使得不会从外部接触携带电流的部件，并且可以通过在短路期间发生的压力来破坏或去除壁。

公开(公告)号：US07760505B2

公开(公告)日：2010-07-20

申请号：US12068174

申请日：2008-02-04

申请人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

发明人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

IPC分类号： H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/40 ,  H01L23/48 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

摘要翻译： 公开了一种功率半导体模块，包括装配有至少一个部件的板型基板和设置成用于经由基板从部件散热的基板。 在至少一个实施例中，保持基板与基板热接触的支撑装置具有与沿着不同方向延伸并旨在使基板接触连接的多个印章邻接的中心压力螺栓 在压力螺栓的机械卸载状态下，印章与基板处于非均匀的距离。

公开(公告)号：US20080217757A1

公开(公告)日：2008-09-11

申请号：US12068174

申请日：2008-02-04

申请人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

发明人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/40 ,  H01L23/48 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor module is disclosed, including a plate-type substrate fitted with at least one component, and a base plate provided for dissipating heat from the component via the substrate. In at least one embodiment, a supporting apparatus, which keeps the substrate in thermal contact with the base plate, has a central pressure bolt adjoined by a plurality of stamps which extend in different directions and are intended to contact-connect the substrate, the individual stamps being at non-uniform distances from the substrate in the mechanically unloaded state of the pressure bolt.

摘要翻译： 公开了一种功率半导体模块，包括装配有至少一个部件的板型基板和设置成用于经由基板从部件散热的基板。 在至少一个实施例中，保持基板与基板热接触的支撑装置具有与沿着不同方向延伸并旨在使基板接触连接的多个印章邻接的中心压力螺栓 在压力螺栓的机械卸载状态下，印章与基板处于非均匀的距离。

公开(公告)号：US20080061912A1

公开(公告)日：2008-03-13

申请号：US11896561

申请日：2007-09-04

申请人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

发明人： Markus Meier ,  Bertrand Viala ,  Stephan Jonas

IPC分类号： H01H9/02

CPC分类号： H05K7/1432

摘要： A semiconductor switching module is disclosed, including a housing, the housing having openings to carry away pressure which occurs in the case of a short circuit. In at least one embodiment, the semiconductor switching module includes an inexpensive, compact housing construction. Further, after a short circuit, there is no danger to station parts or persons. In at least one embodiment, the semiconductor switching module includes a housing, the housing having openings, which can be sealed by thin walls, to carry away pressure which occurs in the case of a short circuit, the thin walls being dimensioned so that they can be destroyed or removed by the pressure which occurs in the case of a short circuit, and the openings being dimensioned so that parts which carry current cannot be touched from outside. The semiconductor switching module according to at least one embodiment, despite being compact, inexpensive construction, still achieves a high short circuit value. Further, the disadvantages of the traditional open housing construction being avoided. In principle, this is achieved in that in the case of a short circuit, the pressure can be carried away via defined openings. In the case of normal operation, these openings are sealed by thin walls. By sealing in this way, for example, the sealing which is required in the case of bonded semiconductor switching modules can be kept in the housing, and an optically closed housing can be implemented.

摘要翻译： 公开了一种半导体开关模块，其包括壳体，该壳体具有用于承载在短路情况下发生的压力的开口。 在至少一个实施例中，半导体开关模块包括廉价的，紧凑的壳体结构。 此外，在短路之后，没有驻车部件或人员的危险。 在至少一个实施例中，半导体开关模块包括壳体，壳体具有可被薄壁密封的开口，以承载在短路情况下发生的压力，薄壁的尺寸被设计成使得它们可以 由于在短路的情况下发生的压力而被破坏或去除，并且开口的尺寸被确定为使得携带电流的部分不能从外部被触摸。 根据至少一个实施例的半导体开关模块尽管是紧凑的，便宜的结构，仍然实现了高的短路值。 此外，传统的开放式住房建设的缺点也被避免。 原则上，这是通过在短路的情况下实现的，可以通过限定的开口带走压力。 在正常操作的情况下，这些开口被薄壁密封。 通过这样的密封，例如，在接合的半导体开关模块的情况下所需的密封可以保持在壳体中，并且可以实现光学关闭的壳体。

公开(公告)号：US07737811B2

公开(公告)日：2010-06-15

申请号：US12000495

申请日：2007-12-13

申请人： Jürgen Trottmann ,  Markus Meier ,  Bertrand Viala ,  Arndt-Peter Wolf

发明人： Jürgen Trottmann ,  Markus Meier ,  Bertrand Viala ,  Arndt-Peter Wolf

IPC分类号： H01H9/02 ,  H01H13/04

CPC分类号： H01H50/045 ,  H01H50/36 ,  H01H2050/046 ,  H01H2050/446

摘要： An electromechanical switching device of at least one embodiment includes fixed contacts securely arranged in a housing and a moving contact bridge for bridging the fixed contacts, a moving contact carrier to carry the contact bridge, and a solenoid to act on the contact carrier. In at least one embodiment the solenoid includes a coil body fixed to the housing, an armature coupled to the contact carrier so as to move with it, a yoke to act together with the armature, and a fixing mechanism, which engages with the yoke and coil body for fixing the yoke to the coil body.

摘要翻译： 至少一个实施例的机电开关装置包括牢固地布置在壳体中的固定触点和用于桥接固定触点的移动触点桥，用于承载触点桥的移动触点载体以及作用在触点载体上的螺线管。 在至少一个实施例中，螺线管包括固定到壳体的线圈体，与接触载体耦合以便与其一起移动的电枢，轭架与电枢一起作用的轭和与轭架接合的固定机构， 线圈体，用于将轭固定到线圈体。

公开(公告)号：US20080258851A1

公开(公告)日：2008-10-23

申请号：US12000495

申请日：2007-12-13

申请人： Jurgen Trottmann ,  Markus Meier ,  Bertrand Viala ,  Arndt-Peter Wolf

发明人： Jurgen Trottmann ,  Markus Meier ,  Bertrand Viala ,  Arndt-Peter Wolf

IPC分类号： H01H67/26

CPC分类号： H01H50/045 ,  H01H50/36 ,  H01H2050/046 ,  H01H2050/446

摘要： An electromechanical switching device of at least one embodiment includes fixed contacts securely arranged in a housing and a moving contact bridge for bridging the fixed contacts, a moving contact carrier to carry the contact bridge, and a solenoid to act on the contact carrier. In at least one embodiment the solenoid includes a coil body fixed to the housing, an armature coupled to the contact carrier so as to move with it, a yoke to act together with the armature, and a fixing mechanism, which engages with the yoke and coil body for fixing the yoke to the coil body.

摘要翻译： 至少一个实施例的机电开关装置包括牢固地布置在壳体中的固定触点和用于桥接固定触点的移动触点桥，用于承载触点桥的移动触点载体以及作用在触点载体上的螺线管。 在至少一个实施例中，螺线管包括固定到壳体的线圈体，与接触载体耦合以便与其一起移动的电枢，轭架与电枢一起作用的轭和与轭架接合的固定机构， 线圈体，用于将轭固定到线圈体。

公开(公告)号：USD619969S1

公开(公告)日：2010-07-20

申请号：US29272945

申请日：2007-02-23

申请人： Walter Apfelbacher ,  Bertrand Viala

设计人： Walter Apfelbacher ,  Bertrand Viala