公开(公告)号：US06743849B2

公开(公告)日：2004-06-01

申请号：US09886256

申请日：2001-06-22

申请人： Masaaki Mawatari ,  Kenji Mitamura

发明人： Masaaki Mawatari ,  Kenji Mitamura

IPC分类号： C08L7700

CPC分类号： C08L77/00 ,  C08G69/26 ,  C08L77/06

摘要： The invention provides a thermoplastic resin composition having excellent blister resistance, which does not cause blister on the surfaces of resinous parts by passing through a reflowing oven when the resin composition is used as a resin material forming the resinous parts subjected to the surface-mount technology system, particularly, a thermoplastic resin composition high in mechanical strength such as flexural strength, weld strength and tensile elongation and excellent in moldability and friction property. The resin composition contains a polyamide resin component composed of 5 to 95% by weight of the following component (A) and 95 to 5% by weight of the following component (B): Component (A): a polyamide resin obtained by polycondensing diamine(s) including at least tetramethylenediamine with dicarboxylic acid(s) including at least adipic acid; and Component (B): a polyamide resin obtained by polycondensing diamine(s) including at least one of 1,9-nonanediamine and 2-methyl-1,8-octanediamine with dicarboxylic acid(s) including at least terephthalic acid.

摘要翻译： 本发明提供一种具有优异的耐起泡性的热塑性树脂组合物，当树脂组合物用作形成经表面安装技术的树脂部分的树脂材料时，通过回流炉不会引起树脂部件表面的起泡 特别是具有抗弯强度，焊接强度，拉伸伸长率等机械强度高，成型性和摩擦性优异的热塑性树脂组合物。 树脂组合物含有由以下组分（A）5至95重量％和以下组分（B）95至5重量％组成的聚酰胺树脂组分：组分（A）：通过缩聚二胺 包括至少包含至少四甲基二胺与至少包含己二酸的二羧酸; 和组分（B）：通过将包含1,9-壬二胺和2-甲基-1,8-辛二胺中的至少一种的二胺与至少包含对苯二甲酸的二羧酸缩聚得到的聚酰胺树脂。