公开(公告)号：US06784279B2

公开(公告)日：2004-08-31

申请号：US10185485

申请日：2002-06-27

申请人： Masahiro Nozaki ,  Reiko Koshida ,  Takeo Tasaka ,  Tadao Ushida

发明人： Masahiro Nozaki ,  Reiko Koshida ,  Takeo Tasaka ,  Tadao Ushida

IPC分类号： C08L7706

CPC分类号： C08K7/00 ,  C08K3/34 ,  C08K7/10 ,  C08K2201/016 ,  C08L77/10

摘要： The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage. In a representative composition, 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 &mgr;m to approximately 180 &mgr;m and a number average diameter of approximately 0.1 &mgr;m to 15.00 &mgr;m and the average aspect ratio of which is greater than 3:1 is compounded with 100 parts by weight of semi-aromatic polyamide in which the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol % and the melting point of which is greater than 280° C.

摘要翻译： 本发明提供了一种具有优异的刚性，强度，韧性，尺寸稳定性，耐化学品性，外表面外观和在高温环境中的滑动特性的芳族聚酰胺组合物，其具有低线性系数 膨胀并且具有低翘曲。在代表性组合物中，5至170重量份的数均分子量约5μm至约180μm的硅灰石和数均粒径为约0.1μm至15.00μm，平均方面 其比例大于3:1与100重量份的半芳族聚酰胺配合，其中形成聚酰胺的单体组分中的芳族单体的量大于20mol％，其熔点较大 超过280℃