Aromatic polyamide compositions for molding
    1.
    发明授权
    Aromatic polyamide compositions for molding 有权
    用于成型的芳族聚酰胺组合物

    公开(公告)号:US06784279B2

    公开(公告)日:2004-08-31

    申请号:US10185485

    申请日:2002-06-27

    IPC分类号: C08L7706

    摘要: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage. In a representative composition, 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 &mgr;m to approximately 180 &mgr;m and a number average diameter of approximately 0.1 &mgr;m to 15.00 &mgr;m and the average aspect ratio of which is greater than 3:1 is compounded with 100 parts by weight of semi-aromatic polyamide in which the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol % and the melting point of which is greater than 280° C.

    摘要翻译: 本发明提供了一种具有优异的刚性,强度,韧性,尺寸稳定性,耐化学品性,外表面外观和在高温环境中的滑动特性的芳族聚酰胺组合物,其具有低线性系数 膨胀并且具有低翘曲。在代表性组合物中,5至170重量份的数均分子量约5μm至约180μm的硅灰石和数均粒径为约0.1μm至15.00μm,平均方面 其比例大于3:1与100重量份的半芳族聚酰胺配合,其中形成聚酰胺的单体组分中的芳族单体的量大于20mol%,其熔点较大 超过280℃