公开(公告)号：US08506718B2

公开(公告)日：2013-08-13

申请号：US12857938

申请日：2010-08-17

申请人： Takehiro Shindou ,  Masaki Kondo

发明人： Takehiro Shindou ,  Masaki Kondo

IPC分类号： B08B5/00

CPC分类号： H01L21/31138 ,  H01L21/0209 ,  H01L21/67069

摘要： A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.

摘要翻译： 用于去除环状地附着到目标基板的周边部分上的聚合物的聚合物去除装置包括：处理室，用于容纳具有环状粘附到其周边部分上的聚合物的目标基板; 用于将目标基板安装在其上的安装台; 以及激光照射单元，其用于将环状激光一次照射到环状地粘附到目标基板的整个聚合物上。 聚合物除去装置还包括臭氧气体供给单元，其用于将臭氧气体供给到环状粘附到目标基板上的聚合物，以及用于排出臭氧气体的排气单元。

公开(公告)号：US20110041874A1

公开(公告)日：2011-02-24

申请号：US12857938

申请日：2010-08-17

申请人： Takehiro Shindou ,  Masaki Kondo

发明人： Takehiro Shindou ,  Masaki Kondo

IPC分类号： B08B7/00 ,  B23K26/16

CPC分类号： H01L21/31138 ,  H01L21/0209 ,  H01L21/67069

摘要： A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.

摘要翻译： 用于去除环状地附着到目标基板的周边部分上的聚合物的聚合物去除装置包括：处理室，用于容纳具有环状粘附到其周边部分上的聚合物的目标基板; 用于将目标基板安装在其上的安装台; 以及激光照射单元，其用于将环状激光一次照射到环状地粘附到目标基板的整个聚合物上。 聚合物除去装置还包括臭氧气体供给单元，其用于将臭氧气体供给到环状粘附到目标基板上的聚合物，以及用于排出臭氧气体的排气单元。

公开(公告)号：US08454752B2

公开(公告)日：2013-06-04

申请号：US12635107

申请日：2009-12-10

申请人： Masaki Kondo ,  Takehiro Shindou

发明人： Masaki Kondo ,  Takehiro Shindou

IPC分类号： B08B5/00

CPC分类号： H01L21/6708 ,  B08B7/0042 ,  B23K26/0006 ,  B23K26/0823 ,  B23K26/12 ,  B23K26/127 ,  B23K26/14 ,  B23K26/16 ,  B23K26/352 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67115 ,  H01L21/67742 ,  H01L21/681

摘要： A foreign substance removing apparatus includes a mounting table for mounting and rotating a substrate; and a laser beam irradiation unit for removing foreign substances attached to a surface of the substrate by irradiating foreign substance cleaning laser beam onto the substrate mounted and rotated on the mounting table. In the foreign substance removing apparatus, the laser beam irradiation unit irradiates laser beam having an elongate shaped irradiation cross section onto the surface of the substrate.

摘要翻译： 异物除去装置具有安装基板的旋转安装台， 以及激光束照射单元，用于通过将外来物质清洁激光束照射到在安装台上安装和旋转的基板上去除附着到基板表面的异物。 在异物去除装置中，激光束照射单元将具有细长形状的照射截面的激光束照射到基板的表面上。

公开(公告)号：US08497132B2

公开(公告)日：2013-07-30

申请号：US12612923

申请日：2009-11-05

申请人： Takehiro Shindou

发明人： Takehiro Shindou

IPC分类号： G01N7/00 ,  C01B13/10 ,  H01L21/4757

CPC分类号： C01B13/10 ,  C01B13/11 ,  C01B2201/62 ,  Y10T436/206664

摘要： An ozone gas concentration measurement method that can easily measure the concentration of ozone gas. A process gas containing ozone gas is produced from a raw gas containing oxygen gas. The number of moles of gas molecules contained in the process gas is measured. The concentration of the ozone gas contained in the process gas is calculated based on the number of moles of gas molecules contained in the process gas.

摘要翻译： 臭氧气体浓度测定方法，能够容易地测量臭氧气体的浓度。 由含有氧气的原料气体生成含有臭氧气体的工艺气体。 测量处理气体中含有的气体分子的摩尔数。 基于处理气体中含有的气体分子的摩尔数计算处理气体中所含的臭氧气体的浓度。