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公开(公告)号:US06791034B2
公开(公告)日:2004-09-14
申请号:US10238688
申请日:2002-09-10
申请人: Masaki Suzumura , Kazuo Okada , Koichi Hirano , Takaaki Okawa , Shinya Tanaka
发明人: Masaki Suzumura , Kazuo Okada , Koichi Hirano , Takaaki Okawa , Shinya Tanaka
IPC分类号: H05K100
CPC分类号: H05K3/0061 , H01L23/49861 , H01L23/5387 , H01L2924/0002 , H05K3/041 , H05K3/202 , H05K3/28 , H05K2201/0209 , H05K2203/066 , H01L2924/00
摘要: A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.
摘要翻译: 电路板的引线框架在与散热板相反的方向上冲压。 即使由于冲孔产生毛刺,毛刺也不会渗透到薄片或与散热板短路。 抗蚀剂膜在电路板的引线框架的焊盘的周围紧密接触,并且电镀层紧密地接触在焊盘上。 这样可以防止电子元件在地面上的安装不良。