专利检索 ap:("Massachusetts Institute of Technology") AND inv:"Jeremiah Mwaura" 第 1 页

1.

发明授权
Transferable ultra-thin substrates and related techniques 有权

公开(公告)号：US11935977B2

公开(公告)日：2024-03-19

申请号：US17938180

申请日：2022-10-05

申请人： Massachusetts Institute of Technology

发明人： Vladimir Bulovic , Mayuran Saravanapavanantham , Jeremiah Mwaura

IPC分类号： H01L31/18 , H01L31/0224 , H01L31/0468

CPC分类号： H01L31/0468 , H01L31/022441 , H01L31/022466 , H01L31/1896

摘要： A device, comprising: a flexible carrier; a release layer that is formed on the flexible carrier; a releasable substrate formed over the release layer; and a semiconductor structure that is formed over the releasable substrate.