Abstract:
A method of producing unitary formed silicon balance spring having an overcoil portion for regulation of a mechanical timepiece, said method including the steps of providing a silicon balance spring having a main body portion, and an outer portion for formation as an overcoil portion, wherein the outer portion extends radially outward from an outermost turn of the main body portion, and wherein said main body portion and said outer portion are integrally formed from a silicon based material and are formed in a co-planar configuration; moving said outer portion in a direction relative to and out of the plane of said main body portion, and in a direction towards over said main body portion and towards the plane of the main body portion; and providing a stress relaxation process to the balance spring so as to relieve internal stresses induced within the balance spring from step (ii); wherein upon movement of said outer portion into the plane of said main body portion, the outer portion is located in an overcoil configuration relative to said main body portion.
Abstract:
A method of fabricating a component for use in a watch includes a step of depositing a first thin film on a wafer wherein the first thin film is adapted to allow light reflected away from the wafer to be indicative of a first color characteristic. The step of depositing the first thin film is performed by using a plasma-enhanced chemical vapor deposition process or a low pressure chemical vapor deposition process. The method may further include a step of fabricating a second color characteristic, including defining a pattern on the first thin film using photolithography, and, processing a region within a boundary of the pattern so that the region is adapted to allow light reflected away from the wafer to be indicative of the second color characteristic. The step of processing the region within the boundary of the pattern includes depositing a metal or a ceramic material within the boundary of the pattern which is indicative of the second color characteristic. The step of processing the region within the boundary of the pattern may also include depositing a second thin film within the region within the boundary of the pattern.