公开(公告)号：US06700163B2

公开(公告)日：2004-03-02

申请号：US09683278

申请日：2001-12-07

申请人： Matthew J. Breitwisch ,  Jeffrey S. Brown ,  Terence B. Hook ,  Randy W. Mann ,  Christopher S. Putnam ,  Mohammad I. Younus

发明人： Matthew J. Breitwisch ,  Jeffrey S. Brown ,  Terence B. Hook ,  Randy W. Mann ,  Christopher S. Putnam ,  Mohammad I. Younus

IPC分类号： H01L2976

CPC分类号： H01L21/823871 ,  H01L21/823842

摘要： A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has suicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and silicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.

摘要翻译： 本文公开了选择性硅化半导体结构及其制造方法。 半导体结构在N +扩散或N +有源区域之间的多晶硅线路上存在自杀，并且在多晶硅线路的N + / P +结处的P +扩散或有源区域存在自杀，并且在N +有源区域和P +活性区域上不存在硅化物 区。 这种选择性硅化的存在在多晶硅线的N +区和多晶硅线的P +区之间产生有益的低电阻连接。 在N +和P +有源区，特别是PFET和NFET结构上不存在硅化，可防止与器件硅化相关的电流泄漏。

公开(公告)号：US06881672B2

公开(公告)日：2005-04-19

申请号：US10723700

申请日：2003-11-26

申请人： Matthew J. Breitwisch ,  Jeffrey S. Brown ,  Terence B. Hook ,  Randy W. Mann ,  Christopher S. Putnam ,  Mohammad I. Younus

发明人： Matthew J. Breitwisch ,  Jeffrey S. Brown ,  Terence B. Hook ,  Randy W. Mann ,  Christopher S. Putnam ,  Mohammad I. Younus

IPC分类号： H01L21/8238 ,  H01L21/44

CPC分类号： H01L21/823871 ,  H01L21/823842

摘要： A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has silicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and silicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.

摘要翻译： 本文公开了选择性硅化半导体结构及其制造方法。 半导体结构在多晶硅线路上存在硅化物，N +扩散区域或N +有源区域与多晶硅线路的N + / P +结处的P +扩散区域或有源区域之间存在硅化物，而N +有源区域和P +活性区域上不存在硅化物 区。 这种选择性硅化的存在在多晶硅线的N +区和多晶硅线的P +区之间产生有益的低电阻连接。 在N +和P +有源区，特别是PFET和NFET结构上不存在硅化，可防止与器件硅化相关的电流泄漏。