公开(公告)号：US11894485B2

公开(公告)日：2024-02-06

申请号：US17487623

申请日：2021-09-28

Applicant: Maxeon Solar Pte. Ltd

Inventor： Vergil R. Sandoval ,  Emmanuel C. Abas ,  Yafu Lin

IPC: H01L31/18 ,  H01B13/00 ,  H01L31/05

CPC classification number: H01L31/188 ,  H01B13/0003 ,  H01L31/05 ,  Y10T29/49117

Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.

公开(公告)号：US12176456B2

公开(公告)日：2024-12-24

申请号：US18409190

申请日：2024-01-10

Applicant: MAXEON SOLAR PTE. LTD.

Inventor： Vergil R. Sandoval ,  Emmanuel C. Abas ,  Yafu Lin

IPC: H01L31/18 ,  H01B13/00 ,  H01L31/05

Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.