公开(公告)号：US07807980B2

公开(公告)日：2010-10-05

申请号：US11647348

申请日：2006-12-29

申请人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G21K7/00 ,  A61N5/00 ,  G21G5/00

CPC分类号： H01J37/263 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2826

摘要： The present invention provides a charged particle beam apparatus used to measure micro-dimensions (CD value) of a semiconductor apparatus or the like which captures images for measurement. For the present invention, a sample for calibration, on which a plurality of polyhedral structural objects with known angles on surfaces produced by the crystal anisotropic etching technology are arranged in a viewing field, is used. A beam landing angle at each position within a viewing field is calculated based on geometric deformation on an image of each polyhedral structural object. Beam control parameters for equalizing the beam landing angle at each position within the viewing field are pre-registered. The registered beam control parameters are applied according to the position of the pattern to be measured within the viewing field when performing dimensional measurement. Accordingly, the present invention provides methods for reducing the variation in the CD value caused by the variation in the electron beam landing angle with respect to the sample with an equal beam landing angle and methods for reducing the instrumental error caused by the difference in the electron beam landing angle between apparatuses.

摘要翻译： 本发明提供一种用于测量捕获用于测量的图像的半导体装置等的微尺寸（CD值）的带电粒子束装置。 对于本发明，使用用于校准的样品，其上在视场中排列有通过晶体各向异性蚀刻技术产生的表面上具有已知角度的多个多面体结构物体。 基于每个多面体结构物体的图像上的几何变形来计算视野内的每个位置处的束着陆角。 用于均衡视场内每个位置的束着陆角的光束控制参数被预先注册。 当进行尺寸测量时，根据待测图案的位置在观察区域中应用登记的光束控制参数。 因此，本发明提供了减少相对于具有相同束着陆角的样品的电子束着角的变化引起的CD值的变化的方法，以及用于减少由电子差异引起的仪器误差的方法 设备之间的束着陆角度。

公开(公告)号：US07408154B2

公开(公告)日：2008-08-05

申请号：US11260187

申请日：2005-10-28

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G01N23/00 ,  G21K7/00

CPC分类号： H01J37/28 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/2826

摘要： As measurement accuracy required for the scanning electron microscope (SEM) for measuring a pattern width becomes stringent, a technique of reducing the difference in a measured dimension between the SEM's is desired. However, the conventional technique of evaluating the difference in a measured dimension between the SEM's cannot separate the difference in a measured dimension between the SEM's themselves and a dimensional change resulting from deformation of the pattern itself. Moreover, the technique of reducing the difference in a measured dimension between the SEM's needs an operator for reducing the difference in a measured dimension between the SEM's for each measurement pattern shape. In this invention, a pattern at the same position is measured for a plurality of times with each SEM, and a different between extrapolated values of measured values obtained by the respective SEM's is calculated, whereby separation between the difference in a measured dimension between the SEM's and a dimensional change resulting from deformation of the pattern itself is made possible. Moreover, matching electron beam image profiles between the SEM's using an operator that simulates a difference in beam diameter between the SEM's makes it possible to reduce the difference in a measured dimension between the SEM's, not depending on a dimensional measurement pattern shape.

摘要翻译： 由于用于测量图形宽度的扫描电子显微镜（SEM）所需的测量精度变得严格，所以希望减少SEM之间的测量尺寸差异的技术。 然而，评估SEM之间的测量尺寸差异的常规技术不能分离SEM本身之间的测量尺寸与由图案本身的变形引起的尺寸变化之间的差异。 此外，减少SEM之间的测量尺寸的差异的技术需要一个操作者，用于减小每个测量图案形状的SEM之间的测量尺寸的差异。 在本发明中，通过各SEM测量同一位置的图案多次，并且计算通过各SEM得到的测量值的外推值之间的差异，由此SEM之间的测量尺寸差异之间的差异 并且由于图案本身的变形引起的尺寸变化成为可能。 此外，使用模拟SEM之间的光束直径差的SEM的SEM之间的匹配电子束图像轮廓可以减小SEM之间的测量尺寸的差异，而不依赖于尺寸测量图案形状。

公开(公告)号：US08003940B2

公开(公告)日：2011-08-23

申请号：US12349751

申请日：2009-01-07

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： H01J37/28 ,  H01J37/256 ,  G01N23/00

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern formed on a wafer, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern formed on the wafer by using each of the plural scanning electron microscopes.

摘要翻译： 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 在晶片上形成的参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异之间的关系的输出单元 以及由工具状态监视单元监视的多个扫描电子显微镜中的每一个的工具状态。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个对成像在晶片上的参考图案进行成像，监视多个扫描电子显微镜中的每一个的工具状态。

公开(公告)号：US20070164219A1

公开(公告)日：2007-07-19

申请号：US11647348

申请日：2006-12-29

申请人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G21K7/00

CPC分类号： H01J37/263 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2826

摘要： The present invention provides a charged particle beam apparatus used to measure micro-dimensions (CD value) of a semiconductor apparatus or the like which captures images for measurement. For the present invention, a sample for calibration, on which a plurality of polyhedral structural objects with known angles on surfaces produced by the crystal anisotropic etching technology are arranged in a viewing field, is used. A beam landing angle at each position within a viewing field is calculated based on geometric deformation on an image of each polyhedral structural object. Beam control parameters for equalizing the beam landing angle at each position within the viewing field are pre-registered. The registered beam control parameters are applied according to the position of the pattern to be measured within the viewing field when performing dimensional measurement. Accordingly, the present invention provides methods for reducing the variation in the CD value caused by the variation in the electron beam landing angle with respect to the sample with an equal beam landing angle and methods for reducing the instrumental error caused by the difference in the electron beam landing angle between apparatuses.

摘要翻译： 本发明提供一种用于测量捕获用于测量的图像的半导体装置等的微尺寸（CD值）的带电粒子束装置。 对于本发明，使用用于校准的样品，其上在视场中排列有通过晶体各向异性蚀刻技术产生的表面上具有已知角度的多个多面体结构物体。 基于每个多面体结构物体的图像上的几何变形来计算视野内的每个位置处的束着陆角。 用于均衡视场内每个位置的束着陆角的光束控制参数被预先注册。 当进行尺寸测量时，根据待测图案的位置在观察区域中应用登记的光束控制参数。 因此，本发明提供了减少相对于具有相同束着陆角的样品的电子束着角的变化引起的CD值的变化的方法，以及用于减少由电子差异引起的仪器误差的方法 设备之间的束着陆角度。

公开(公告)号：US20070114405A1

公开(公告)日：2007-05-24

申请号：US11583886

申请日：2006-10-20

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G21K7/00

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool matching between a plurality of scanning electron microscopes for pattern dimension measurement includes a measuring unit for, at regular intervals, measuring a tool-to-tool disparity between scanning electron microscopes based on secondary electron image data, and measuring indicators indicating states of the microscopes, a tool-to-tool-disparity causing factor analyzing unit for analyzing a relationship between the tool-to-tool disparity and the values of the indicators measured by the measuring unit to estimate a factor that has caused said tool-to-tool disparity, and an output unit for displaying and outputting the tool-to-tool disparity causing factor estimated by the tool-to-tool-disparity causing factor analyzing unit.

摘要翻译： 用于控制用于图案尺寸测量的多个扫描电子显微镜之间的工具对工具匹配的系统包括用于以规则的间隔测量基于二次电子图像数据的扫描电子显微镜之间的工具对工具差异的测量单元 以及指示显示器状态的测量指示器，工具对工具差异因素分析单元，用于分析工具与工具之间的差异与由测量单元测量的指标的值之间的关系，以估计因素 已经引起了工具对工具的差异，以及输出单元，用于显示和输出由工具对工具差异造成因子分析单元估计的工具对工具差异引起的因素。

公开(公告)号：US08502144B2

公开(公告)日：2013-08-06

申请号：US13190847

申请日：2011-07-26

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： H01J37/28 ,  H01J37/256 ,  G01N23/00

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern by using each of the plural scanning electron microscopes.

摘要翻译： 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异与工具状态之间的关系的输出单元 由工具状态监视单元监视的多个扫描电子显微镜中的每一个。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个来对多个扫描电子显微镜中的每个扫描电子显微镜的工具状态进行监视，同时对参考图案进行成像。

公开(公告)号：US08207512B2

公开(公告)日：2012-06-26

申请号：US12898455

申请日：2010-10-05

申请人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G21K7/00 ,  A61N5/00 ,  G21G5/00

CPC分类号： H01J37/263 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2826

摘要： The present invention provides a charged particle beam apparatus used to measure micro-dimensions (CD value) of a semiconductor apparatus or the like which captures images for measurement. For the present invention, a sample for calibration, on which a plurality of polyhedral structural objects with known angles on surfaces produced by the crystal anisotropic etching technology are arranged in a viewing field, is used. A beam landing angle at each position within a viewing field is calculated based on geometric deformation on an image of each polyhedral structural object. Beam control parameters for equalizing the beam landing angle at each position within the viewing field are pre-registered. The registered beam control parameters are applied according to the position of the pattern to be measured within the viewing field when performing dimensional measurement. Accordingly, the present invention provides methods for reducing the variation in the CD value caused by the variation in the electron beam landing angle with respect to the sample with an equal beam landing angle and methods for reducing the instrumental error caused by the difference in the electron beam landing angle between apparatuses.

摘要翻译： 本发明提供一种用于测量捕获用于测量的图像的半导体装置等的微尺寸（CD值）的带电粒子束装置。 对于本发明，使用用于校准的样品，其上在视场中排列有通过晶体各向异性蚀刻技术产生的表面上具有已知角度的多个多面体结构物体。 基于每个多面体结构物体的图像上的几何变形来计算视野内的每个位置处的束着陆角。 用于均衡视场内每个位置的束着陆角的光束控制参数被预先注册。 当进行尺寸测量时，根据待测图案的位置在观察区域中应用登记的光束控制参数。 因此，本发明提供了减少相对于具有相同束着陆角的样品的电子束着角的变化引起的CD值的变化的方法，以及用于减少由电子差异引起的仪器误差的方法 设备之间的束着陆角度。

公开(公告)号：US20110278453A1

公开(公告)日：2011-11-17

申请号：US13190847

申请日：2011-07-26

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： G01N23/00

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern by using each of the plural scanning electron microscopes.

摘要翻译： 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异与工具状态之间的关系的输出单元 由工具状态监视单元监视的多个扫描电子显微镜中的每一个。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个来对多个扫描电子显微镜中的每个扫描电子显微镜的工具状态进行监视，同时对参考图案进行成像。

公开(公告)号：US20090121134A1

公开(公告)日：2009-05-14

申请号：US12349751

申请日：2009-01-07

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： H01J37/28

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern formed on a wafer, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern formed on the wafer by using each of the plural scanning electron microscopes.

摘要翻译： 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 在晶片上形成的参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异之间的关系的输出单元 以及由工具状态监视单元监视的多个扫描电子显微镜中的每一个的工具状态。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个对成像在晶片上的参考图案进行成像，监视多个扫描电子显微镜中的每一个的工具状态。

公开(公告)号：US07476857B2

公开(公告)日：2009-01-13

申请号：US11583886

申请日：2006-10-20

申请人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

发明人： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC分类号： H01J37/28 ,  H01J37/256 ,  G01N23/00

CPC分类号： H01J37/28 ,  H01J2237/282

摘要： A system for controlling a tool-to-tool matching between a plurality of scanning electron microscopes for pattern dimension measurement includes a measuring unit for, at regular intervals, measuring a tool-to-tool disparity between canning electron microscopes based on secondary electron image data, and measuring indicators indicating states of the microscopes, a tool-to-tool-disparity causing factor analyzing unit for analyzing a relationship between the tool-to-tool disparity and the values of the indicators measured by the measuring unit to estimate a factor that has caused said tool-to-tool disparity, and an output unit for displaying and outputting the tool-to-tool disparity causing factor estimated by the tool-to-tool-disparity causing factor analyzing unit.

摘要翻译： 用于控制用于图案尺寸测量的多个扫描电子显微镜之间的工具对工具匹配的系统包括测量单元，用于以规则的间隔测量基于二次电子图像数据的罐装电子显微镜之间的工具对工具差异 以及指示显示器状态的测量指示器，工具对工具差异因素分析单元，用于分析工具与工具之间的差异与由测量单元测量的指标的值之间的关系，以估计因素 已经引起了工具对工具的差异，以及输出单元，用于显示和输出由工具对工具差异造成因子分析单元估计的工具对工具差异引起的因素。