MODULAR HEART VALVE PROSTHESIS
    3.
    发明公开

    公开(公告)号:US20230310151A1

    公开(公告)日:2023-10-05

    申请号:US18331251

    申请日:2023-06-08

    Inventor: Cahal MCVEIGH

    CPC classification number: A61F2/2418 A61F2/2409 A61F2/2433

    Abstract: A method of delivering and deploying a modular heart valve prosthesis includes delivering a first heart valve device including a first valve support and an anchoring frame in a radially compressed configuration to a site of a native heart valve. A first prosthetic valve including first leaflets having a first thickness is disposed within the first valve support. The method further includes deploying the first heart valve device within native leaflets of the native heart valve, delivering a second heart valve device in a radially compressed configuration to within the first valve support, and deploying the second heart valve device within the first prosthetic valve and the first valve support. The second heart valve device includes a second valve support and a second prosthetic valve comprising second leaflets having a second thickness greater than the first thickness disposed within the second valve support.

    MODULAR HEART VALVE PROSTHESIS
    6.
    发明申请

    公开(公告)号:US20210369451A1

    公开(公告)日:2021-12-02

    申请号:US16885553

    申请日:2020-05-28

    Applicant: MEDTRONIC INC.

    Inventor: Cahal MCVEIGH

    Abstract: A modular heart valve prosthesis includes a first heart valve device and a second heart valve device. The first heart valve device includes a first valve support including a first prosthetic valve disposed within the valve support, and an anchoring frame surrounding the first valve support and coupled to the first valve support. The first prosthetic valve includes synthetic fabric leaflets having a first thickness. The second heart valve device includes a second valve support including a second prosthetic valve disposed within the second valve support. The second prosthetic valve includes tissue leaflets having a second thickness, wherein the second thickness is greater than the first thickness. In a first configuration, the second heart valve device is separate from the first heart valve device, and in a second configuration, the second heart valve device is disposed within the first valve support of the first heart valve device.

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