公开(公告)号：US20220244123A1

公开(公告)日：2022-08-04

申请号：US17571825

申请日：2022-01-10

Applicant: Medtronic, Inc.

Inventor： Andreas Fenner ,  David A. Ruben ,  Andrew J. Ries ,  Chetan Patel

IPC: G01L9/00 ,  B23K26/20 ,  H01L23/522 ,  H05K5/06 ,  H01L23/00

Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

公开(公告)号：US11725995B2

公开(公告)日：2023-08-15

申请号：US17571825

申请日：2022-01-10

Applicant: Medtronic, Inc.

Inventor： Andreas Fenner ,  David A. Ruben ,  Andrew J. Ries ,  Chetan Patel

IPC: G01L9/00 ,  H01L23/00 ,  H05K5/06 ,  A61B5/0215 ,  B23K26/20 ,  H01L23/522

CPC classification number: G01L9/0073 ,  B23K26/20 ,  H01L23/5226 ,  H01L24/48 ,  H05K5/06 ,  A61B5/0215 ,  A61B2562/0247

Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.