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公开(公告)号：US20230191137A1
公开(公告)日：2023-06-22
申请号：US17866734
申请日：2022-07-18
Applicant: Medtronic, Inc.
Inventor： John Mertz , Kamal Deep Mothilal , Suping Lyu
CPC classification number: A61N1/3752 , C08L75/04
Abstract: Various embodiments of an implantable medical device and a method of forming such device are disclosed. The device includes a housing that has a first portion and a second portion connected to the first portion. The first portion includes a polymer material and the second portion includes a transparent polymer material. The housing further includes a lead bore that extends between a first end at an outer surface of the housing and a second end disposed within the housing.
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