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公开(公告)号：US20230191138A1
公开(公告)日：2023-06-22
申请号：US17877303
申请日：2022-07-29
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Pradipta K. Das , Kelly A. DeVries
CPC classification number: A61N1/3754 , A61N1/3956
Abstract: Various embodiments of an implantable medical device and a system that includes such device are disclosed. The device includes a housing including a polymeric material, and an electronics module disposed within the housing and having a substrate, a power source disposed on the substrate, and circuitry disposed on the substrate and electrically connected to the power source. The device also includes a conformal coating disposed over at least a portion of the electronics module.
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