公开(公告)号：US20210186422A1

公开(公告)日：2021-06-24

申请号：US17101975

申请日：2020-11-23

Applicant: Medtronic, Inc.

Inventor： Christian S. Nielsen ,  Hailiang Zhao ,  Kenneth D. Warnock

IPC: A61B5/00 ,  H05K5/04 ,  H05K5/06 ,  A61B5/042 ,  A61B5/0215

Abstract: In some examples, manufacturing techniques for implantable medical devices are described. An example method may including positioning a metal housing component adjacent to a polymer housing component so that there is an interface between the metal housing component and the polymer housing component; and forming a seal at the interface between the metal housing component and the polymer housing component to join the metal housing component and the polymer housing component, wherein the joined metal housing component and the polymer housing component form at least a portion of housing for the implantable medical device, wherein the housing of the implantable medical device contains electronic circuitry.