-
公开(公告)号：US20140368266A1
公开(公告)日：2014-12-18
申请号：US14473156
申请日：2014-08-29
Applicant: Medtronic, Inc.
Inventor： Mohsen Askarinya , Mark R Boone , Andreas A Fenner , Lejun Wang , Kenneth Heames
CPC classification number: H01L25/00 , A61N1/3758 , A61N1/3968 , H01F27/2804 , H01F2027/2819 , H01L23/647 , H01L25/16 , H01L2924/0002 , H01L2924/00
Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.
Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。
-
公开(公告)号：US09496241B2
公开(公告)日：2016-11-15
申请号：US14473156
申请日：2014-08-29
Applicant: Medtronic, Inc.
Inventor： Mohsen Askarinya , Mark R Boone , Andreas A Fenner , Lejun Wang , Kenneth Heames
CPC classification number: H01L25/00 , A61N1/3758 , A61N1/3968 , H01F27/2804 , H01F2027/2819 , H01L23/647 , H01L25/16 , H01L2924/0002 , H01L2924/00
Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.
Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。
-
Search Results
2
records
(took 0.011 seconds)
