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    NOISE REDUCTION FOR SENSOR APPARATUS
    1.
    发明公开
    NOISE REDUCTION FOR SENSOR APPARATUS 审中-公开

    公开(公告)号：US20230314340A1

    公开(公告)日：2023-10-05

    申请号：US17707241

    申请日：2022-03-29

    Applicant: Medtronic, Inc.

    Inventor： Luling Wang ,  Anna M. Belle ,  Mohsen Askarinya ,  David A. Ruben ,  Omid Mahdavi ,  David A. Anderson ,  Shawn C. Kelley

    IPC: G01N21/93 ,  A61B5/1495 ,  A61B5/145

    CPC classification number: G01N21/93 ,  A61B5/14865 ,  A61B5/14532 ,  A61B5/1495

    Abstract: An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of biotransducers and a controller. The plurality of biotransducers are configured to provide a baseline signal, one or more analyte signals, and at least one error condition signal. The plurality of biotransducers at least one reference biotransducer, one or more working biotransducers, and at least one working as reference biotransducer. The controller is operatively coupled to the plurality of biotransducers and is configured to receive the baseline signal, the one or more analyte signals, and the error correction signal. The controller is further configured to determine and/or output one or more adjusted analyte levels using the baseline signal, the one or more analyte signals, and the error correction signal.

    Integrated circuit packaging for implantable medical devices
    3.
    发明授权
    Integrated circuit packaging for implantable medical devices 有权
    用于可植入医疗器械的集成电路封装

    公开(公告)号：US09496241B2

    公开(公告)日：2016-11-15

    申请号：US14473156

    申请日：2014-08-29

    Applicant: Medtronic, Inc.

    Inventor： Mohsen Askarinya ,  Mark R Boone ,  Andreas A Fenner ,  Lejun Wang ,  Kenneth Heames

    IPC: H05K1/18 ,  H01L25/00 ,  H01F27/28 ,  H01L23/64 ,  H01L25/16 ,  A61N1/375 ,  A61N1/39

    CPC classification number: H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

    Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

    STABLE REFERENCE FOR SENSOR APPARATUS
    4.
    发明公开
    STABLE REFERENCE FOR SENSOR APPARATUS 审中-公开

    公开(公告)号：US20240122505A1

    公开(公告)日：2024-04-18

    申请号：US17964863

    申请日：2022-10-12

    Applicant: Medtronic, Inc.

    Inventor： Anna M. Belle ,  Mohsen Askarinya ,  Omid Mahdavi ,  Luling Wang

    IPC: A61B5/145 ,  A61B5/1486

    CPC classification number: A61B5/14546 ,  A61B5/14865

    Abstract: An analyte sensor apparatus for detecting an analyte in a target environment includes a plurality of electrodes and a controller. The plurality of electrodes may be configured to provide a plurality of electrode signals based on a target environment. The plurality of electrodes may include one or more working electrodes, a first reference electrode, and a second reference electrode. The one or more working electrodes may be configured to provide an analyte signal based on a presence of an analyte in the target environment. The first reference electrode may be configured to provide a first baseline signal of the target environment. The second reference electrode may include a different type of electrode than the first reference electrode. The second reference electrode may be configured to provide a second baseline signal of the target environment. The controller may be operatively coupled to the plurality of electrodes.

    INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES
    9.
    发明申请
    INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES 有权
    用于可植入医疗器械的集成电路包装

    公开(公告)号：US20140368266A1

    公开(公告)日：2014-12-18

    申请号：US14473156

    申请日：2014-08-29

    Applicant: Medtronic, Inc.

    Inventor： Mohsen Askarinya ,  Mark R Boone ,  Andreas A Fenner ,  Lejun Wang ,  Kenneth Heames

    IPC: H01L25/00 ,  A61N1/39

    CPC classification number: H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

    Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

    SYSTEMS, APPARATUS AND METHODS FACILITATING SECURE PAIRING OF AN IMPLANTABLE DEVICE WITH A REMOTE DEVICE USING NEAR FIELD COMMUNICATION
    10.
    发明申请
    SYSTEMS, APPARATUS AND METHODS FACILITATING SECURE PAIRING OF AN IMPLANTABLE DEVICE WITH A REMOTE DEVICE USING NEAR FIELD COMMUNICATION 审中-公开
    使用近场通信的远程设备来实现可植入设备的安全配对的系统，装置和方法

    公开(公告)号：US20140273824A1

    公开(公告)日：2014-09-18

    申请号：US13837554

    申请日：2013-03-15

    Applicant: MEDTRONIC, INC.

    Inventor： Andreas Fenner ,  Mohsen Askarinya ,  Jeffrey York

    IPC: H04B5/00

    CPC classification number: H04B5/0031 ,  A61B5/0031 ,  H04B5/0037 ,  H04L63/0823 ,  H04W4/80 ,  H04W12/003 ,  H04W12/00407 ,  H04W12/00512 ,  H04W12/06 ,  H04W84/18

    Abstract: Systems, apparatus and methods configured to facilitate pairing an implantable device with a remote device using a near field communication (NFC) device attached to the implantable device are presented. In an aspect, an implantable device assembly includes an implantable device and an NFC component externally attached to the implantable device. The NFC component is configured to transmit identification information associated with the implantable device to a reader device using NFC protocol. Transmission is in response to a received request signal.

    Abstract translation: 呈现了配置为便于使用附接到可植入装置的近场通信（NFC）装置将可植入装置与远程装置配对的系统，装置和方法。 一方面，可植入装置组件包括可植入装置和外部连接到可植入装置的NFC组件。 NFC组件被配置为使用NFC协议将与可植入装置相关联的识别信息发送到读取装置。 传输是响应于接收到的请求信号。

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