公开(公告)号：US20200058592A1

公开(公告)日：2020-02-20

申请号：US16536633

申请日：2019-08-09

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Mark R. BOONE ,  Randolph E. CRUTCHFIELD

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.