公开(公告)号：US20200058592A1

公开(公告)日：2020-02-20

申请号：US16536633

申请日：2019-08-09

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Mark R. BOONE ,  Randolph E. CRUTCHFIELD

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

公开(公告)号：US20200058567A1

公开(公告)日：2020-02-20

申请号：US16536716

申请日：2019-08-09

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Mark E. HENSCHEL

IPC: H01L23/08 ,  H01L23/538 ,  H01L23/485 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

公开(公告)号：US20200154567A1

公开(公告)日：2020-05-14

申请号：US16678479

申请日：2019-11-08

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Mark E. HENSCHEL ,  Songhua SHI

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/12

Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and an opening disposed in the substrate. The opening extends between the first major surface and the second major surface. Tantalum material is disposed within the opening. Further, the tantalum material includes tantalum particles. The electrical component also includes an anode electrode disposed on the first major surface of the substrate and over the opening and a cathode electrode disposed on the second major surface of the substrate and over the opening.

公开(公告)号：US20150342060A1

公开(公告)日：2015-11-26

申请号：US14561248

申请日：2014-12-05

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Songhua SHI ,  Mark S. RICOTTA ,  Scott B. SLEEPER ,  Yongqian WANG

IPC: H05K3/28 ,  H05K5/06

CPC classification number: H05K3/284 ,  B29C45/14336 ,  B29C45/14639 ,  B29C45/14836 ,  H05K3/28 ,  H05K2203/1316 ,  H05K2203/1572

Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

Abstract translation: 在将电子部件及其附接接口封装在混合组合件的基板的第一侧上的过程中，流体被供应到封装系统的沟槽，其中混合组件被加载，并且平衡压力由 在封装过程中，沟槽内的流体从衬底的相对的第二侧支撑混合组合件。 系统的流体供应的调节器可以保持平衡压力，例如由系统的控制器控制，该系统的控制器被配置为估计系统的模腔内的压力。